Substrate Carrier Frame Batch Processing for Singulated IC Substrates
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Solution Overview
Problem
The increasing complexity of substrates in heterogeneous integrated circuit devices leads to higher fabrication defects, yield loss, and increased assembly costs due to traditional processing methods, particularly in encapsulation and external connector attachment steps, which are inefficient and costly when dealing with singulated substrates.
Innovation Solution
The use of a Substrate Carrier Frame (SCF) to batch process singulated substrates, allowing for encapsulation and external connector attachment in a more efficient and cost-effective manner by loading singulated substrates into a frame with openings and processing them collectively, using either reusable or disposable frames.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If traditional bulk assembly methods are used for substrates, then assembly efficiency is maintained, but fabrication defects increase and yield loss occurs due to increased substrate complexity and tighter trace spacing
Solution Approach 1:
The patent segments the substrate processing by separating good substrates from bad substrates in a panel. Only good substrates are singulated and assembled individually, while bad substrates remain in the panel and are not processed further. This segmentation approach maintains assembly efficiency for good substrates while avoiding the fabrication defects and yield loss that would occur if entire panels with mixed quality substrates were processed together.
2Manufacturing precision
If good substrates are removed and assembled one at a time, then yield loss is minimized, but assembly costs become prohibitive due to increased processing time and individual handling
Solution Approach 1:
The patent merges the processing of multiple good substrates by assembling them individually and then placing them together in a panel configuration. This allows each substrate to be processed with the precision needed for high yield while maintaining cost efficiency through batch-style handling and panel-level processing for subsequent steps, avoiding the prohibitive costs of completely individualized processing for each substrate.
3Manufacturing precision
If encapsulation is performed on individually assembled substrates, then yield is maintained, but processing costs and time increase significantly
Solution Approach 1:
The patent performs preliminary assembly of good substrates individually to ensure yield, then places them in a panel configuration before encapsulation. This preliminary action allows subsequent encapsulation to be performed on the entire panel at once rather than individually on each substrate, significantly reducing processing time and costs while maintaining the yield benefits of individual substrate selection.
4Productivity
If lids are attached instead of encapsulation, then processing costs are reduced, but device protection from debris and chemicals is compromised
Solution Approach 1:
The patent merges multiple substrates into a panel configuration after individual assembly, then performs encapsulation on the entire panel as a single unit. This approach maintains the cost benefits of efficient batch processing while providing comprehensive protection against debris and chemicals, avoiding the need to choose between cost reduction and protection.
Data Source
AI summary
Method and apparatus for manufacturing multiple singulated complex heterogeneous integrated (HI) or homogeneous integrated circuit devices using a Substrate Carrier Frame (SCF), having multiple nesting cavities in which singulated substrates are placed, and once the SCF has been populated, the manufacturing process of the substrates may proceed as if it were a strip, rather than as individual substrates one at a time.