Substrate Carrier Gas Channels Clamp Ring Temperature Control
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Solution Overview
Problem
Existing substrate carriers for semiconductor processing chambers have limited temperature control and substrate shifting issues when handling smaller substrates, leading to uneven processing and potential scratches, especially when processing chambers are configured for larger substrates.
Innovation Solution
The substrate carrier design includes a carrier base with gas channels for improved thermal conductivity and a clamp ring that applies a pressure differential to prevent substrate shifting, enabling precise temperature control between 20° C to 400° C, suitable for processes like PVD, ALD, and CVD, using a backside gas flow and a clamp ring to secure the substrate.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If substrate carriers are used to handle smaller substrates in processing chambers configured for larger substrates, then substrate transfer capability is improved, but temperature control capability deteriorates
Solution Approach 1:
The substrate carrier is segmented into multiple functional zones: a carrier base with gas channels for thermal control, a substrate pocket for holding the substrate, and a clamp ring for securing. This segmentation allows each zone to perform its specific function optimally while working together as an integrated system.
Solution Approach 2:
Gas channels are formed between the substrate pocket and the carrier base, allowing gas flow to provide both cooling/heating and clamping forces. The gas pressure differential (e.g., 1-10 psi) enables precise control of substrate temperature and position without mechanical contact that could cause scratches.
2Adaptability or versatility
If substrate carriers are used to handle smaller substrates, then compatibility with processing chambers is improved, but substrate stability deteriorates due to substrate shifting
Solution Approach 1:
The clamp ring acts as an intermediary between the substrate and the carrier base, applying uniform pressure through gas channels to secure the substrate without direct mechanical contact. This intermediary mechanism prevents substrate shifting while avoiding scratches that could result from rigid mechanical clamping.
Solution Approach 2:
The system changes the pressure parameter of gas flowing through the channels between the substrate pocket and carrier base. By adjusting gas pressure (e.g., 1-10 psi differential), the substrate is firmly held in position during transfer and processing, preventing shifting while maintaining substrate integrity.
3Device complexity
If substrate carriers with limited heating/cooling control are used, then device complexity is reduced, but manufacturing precision deteriorates due to over or under processing
Solution Approach 1:
The gas channels in the substrate carrier serve multiple functions simultaneously: they provide thermal control (heating or cooling depending on gas temperature), mechanical clamping through pressure differential, and substrate positioning. This multi-functionality achieves precise manufacturing control without adding complex separate systems for each function.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enhances temperature control and reduces substrate shifting, resulting in improved process performance with reduced film loss and better amorphization or refractive index formation during deposition processes, such as α-NbOx and TiOx deposition, while maintaining compatibility with various substrate sizes.
Implementation Method 1
a plurality of gas channels formed between the lower base surface and the substrate pocket
Implementation Method 2
a clamp ring that applies a pressure differential to prevent substrate shifting
Data Source
AI summary
An apparatus for processing a semiconductor substrate, such as an optical device, is described herein. The apparatus includes a substrate carrier which is configured to enable a processing chamber configured to process larger substrates to process a smaller substrate without retrofitting the processing chamber. The substrate carrier includes a carrier base and a clamp ring. The carrier base includes a plurality of gas channels formed within a substrate pocket. The clamp ring is disposed on the carrier base and over the substrate and holds the substrate in place. The clamp ring is either weighted or configured to be help by a separate chamber clamping mechanism.