Substrate Carrier Heater Array for Uniform Wafer Temperature Control
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Solution Overview
Problem
Temperature variations across a substrate during semiconductor and micromechanical fabrication processes lead to inconsistent results, as existing temperature measurement methods are cumbersome and require additional hardware, limiting precision and accuracy.
Innovation Solution
An array of independently controllable heater elements in a substrate carrier measures temperature by resistance, allowing for precise temperature control and measurement without external sensors, using a power supply, controller, and power interfaces to manage heating elements.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If temperature measurement is performed using external sensors or infrared cameras, then temperature can be measured, but the hardware complexity and measurement precision are limited
Solution Approach 1:
The heating elements are designed to serve dual functions: they can apply heat to the substrate and simultaneously function as temperature sensors by measuring their own resistance. This eliminates the need for separate temperature measurement hardware, reducing device complexity while maintaining measurement capability through the inherent temperature-resistance relationship of the heating elements
Solution Approach 2:
The heating elements perform self-diagnosis by measuring their own resistance to determine their temperature. Each heating element acts as both the heating source and the temperature sensor for its location, eliminating the need for external measurement devices and reducing overall system hardware complexity
2Manufacturing precision
If a single temperature control system is used for the entire substrate, then the device complexity is low, but the manufacturing precision suffers due to temperature variations across different locations
Solution Approach 1:
The substrate carrier is divided into multiple independently controllable heating zones, each with its own heating element and temperature control capability. This segmentation allows different regions of the substrate to be heated to different temperatures simultaneously, enabling precise local temperature control that maintains fabrication consistency across the entire substrate while managing complexity through modular zone control
Solution Approach 2:
Each heating element can be independently controlled to provide the specific temperature required for different locations on the substrate. This local quality approach ensures that each region receives the optimal temperature for its specific fabrication requirements, improving overall manufacturing precision while maintaining manageable system complexity through independent zone control
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables real-time temperature monitoring and control across the substrate, improving process precision and reducing hardware complexity, thus ensuring consistent fabrication results.
Implementation Method 1
a plurality of resistive heating elements in the carrier to heat the substrate by heating the carrier
Implementation Method 2
The heating elements have a resistance that is related to temperature so that the resistance of a heating element can be measured as an indication of the temperature of the support
Data Source
AI summary
A substrate carrier is described with an array of independently controllable heater elements. In one example an apparatus includes a substrate carrier to carry a substrate for processing, a plurality of resistive heating elements in the carrier to heat the substrate by heating the carrier, a power supply to supply power to the heating elements, a power controller to provide a control signal, the control signal to control an amount of current applied to each of the heating elements, and a plurality of power interfaces in the carrier each coupled to a heating element to receive the power from the power supply and the control signal from the controller and to modulate the power applied to a respective coupled heating element in response to the control signal.