Substrate Carrier Pore Network Suction Adhesion
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Solution Overview
Problem
Conventional substrate carriers using adhesives for attaching substrates can result in residual adhesive issues, which impair further processing steps and contaminate the processing atmosphere due to adhesive degassing, especially under low pressure or high temperature conditions.
Innovation Solution
A substrate carrier with a pore network and sealing member that uses suction to adhere substrates without adhesives, featuring a vacuum system with adjustable suction distribution and temperature-stable materials to maintain a consistent vacuum, reducing the risk of substrate bending and improving process outcomes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If adhesive is used to attach substrate to substrate carrier, then substrate adhesion is achieved, but residual adhesive remains after substrate release which impairs further processing steps
Solution Approach 1:
The patent extracts the harmful adhesive material from the substrate carrier system and replaces it with a suction-based holding mechanism. The porous substrate carrier allows vacuum to be applied through its structure, creating holding force without any adhesive residue that would contaminate the substrate or interfere with subsequent processing steps.
Solution Approach 2:
The patent replaces the chemical bonding mechanism (adhesive) with a mechanical field (vacuum suction). The porous structure of the substrate carrier enables vacuum pressure to be applied uniformly across the substrate surface, providing secure holding without any chemical residues that would require cleaning or interfere with further processing.
2Strength
If adhesive is used to attach substrate, then substrate is held securely, but adhesive degases under low pressure or high temperature contaminating the processing atmosphere
Solution Approach 1:
The patent removes the adhesive material entirely from the system, eliminating the source of degassing contamination. The suction-based holding mechanism uses only vacuum pressure applied through the porous carrier structure, which generates no volatile products that would contaminate the processing atmosphere during low pressure or high temperature operations.
Solution Approach 2:
The porous substrate carrier creates a controlled vacuum environment that is inherently clean and free from contaminating volatiles. By using vacuum suction through the porous structure rather than adhesive bonding, the system maintains a clean processing atmosphere that does not introduce harmful degassing products during substrate processing.
3Device complexity
If uniform suction is applied across entire substrate carrier, then simple vacuum holding is achieved, but substrate may bend or deform under non-uniform stress
Solution Approach 1:
The patent applies different suction characteristics to different regions of the substrate carrier. The porous structure allows for spatially varying vacuum pressure distribution, with stronger suction in central regions and reduced suction at edges, preventing substrate bending while maintaining secure holding. This local differentiation of suction quality ensures substrate flatness is preserved during processing.
Solution Approach 2:
The patent enables dynamic control of the vacuum distribution across the porous substrate carrier. The suction pressure can be adjusted in different regions and at different times during the processing cycle, allowing the system to adapt to various substrate sizes, shapes, and processing requirements while maintaining optimal holding force and preventing deformation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution eliminates adhesive-related issues, ensures better substrate support, and maintains a clean processing environment by using suction to adhere substrates, enhancing the precision and reliability of processes like photolithography.
Implementation Method 1
at least one evacuation port for creating a vacuum in the pore network, such that a substrate received over the substrate-supporting region is adhered by suction
Data Source
AI summary
According to various embodiments, a substrate carrier may include: a substrate-supporting region for supporting a substrate; wherein a first portion of the substrate-supporting region including a pore network of at least partially interconnected pores; wherein a second portion of the substrate-supporting region surrounds the first portion and includes a sealing member for providing a contact sealing; at least one evacuation port for creating a vacuum in the pore network, such that a substrate received over the substrate-supporting region is adhered by suction; and at least one valve configured to control a connection between the pore network and the at least one evacuation port, such that a vacuum can be maintained in the pore network; wherein the pore network includes a first pore characteristic in a first region and a second pore characteristic in a second region different from the first pore characteristic.