Substrate Carrier Purge Chamber Control for Contamination Prevention

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Solution Overview

Problem

Existing electronic device manufacturing systems face inefficiencies and quality issues due to exposure of substrates to high humidity, oxygen levels, and chemical contaminants during processing, which can adversely affect substrate properties.

Innovation Solution

The implementation of an electronic device processing system that includes a factory interface with environmental control systems to monitor and control parameters like humidity, temperature, oxygen levels, and chemical contaminants, ensuring that substrates are only processed within predetermined safe conditions, using inert gases and sensors to maintain a controlled environment from 'cradle to grave' during transit and processing.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of operation

If substrates are exposed to ambient environment during transit and processing, then ease of operation is improved, but substrate quality deteriorates due to contamination from humidity, oxygen, and chemical contaminants

Engineering Contradiction:

Improveease of operationVSAvoidsubstrate contamination

Core Design Contradiction:

Ease of operationVSObject-affected harmful factors

Solution Approach 1:

The patent implements inert atmosphere environments within substrate carriers and factory interface chambers to prevent substrate contamination. Inert gases are used to displace ambient air, creating a controlled environment that eliminates exposure to harmful factors like humidity, oxygen, and chemical contaminants during substrate transit and processing operations.

Inventive Principle:

Principle #39Inert atmosphere (Inert environment)

Solution Approach 2:

The patent introduces environmental control systems as intermediaries between the substrate and the ambient environment. These systems include sensors and control mechanisms that monitor and regulate environmental parameters (humidity, temperature, oxygen levels, chemical contaminants) within the factory interface chamber and substrate carriers, acting as a buffer that protects substrates while allowing operational access.

Inventive Principle:

Principle #24Intermediary (Mediator)

2Object-affected harmful factors

If environmental control systems are implemented to monitor and control humidity, temperature, oxygen levels, and chemical contaminants, then substrate quality is improved, but device complexity increases

Engineering Contradiction:

Improvesubstrate contaminationVSAvoiddevice complexity

Core Design Contradiction:

Object-affected harmful factorsVSDevice complexity

Solution Approach 1:

The environmental control system is designed to perform multiple functions simultaneously: monitoring humidity, temperature, oxygen levels, and chemical contaminants within a single integrated system. The factory interface chamber and substrate carriers are configured to provide both substrate containment and environmental control capabilities, reducing the need for separate dedicated systems for each parameter.

Inventive Principle:

Principle #6Universality (Multi-functionality)

Solution Approach 2:

The environmental control system incorporates sensors and control mechanisms that automatically monitor and adjust environmental parameters without requiring constant external intervention. The system self-regulates by detecting changes in environmental conditions and activating appropriate control actions, reducing operational complexity while maintaining substrate protection.

Inventive Principle:

Principle #25Self-service

3Object-affected harmful factors

If substrates are protected from ambient environment throughout processing, then substrate quality is improved, but productivity decreases due to additional processing steps

Engineering Contradiction:

Improvesubstrate contaminationVSAvoidprocessing efficiency

Core Design Contradiction:

Object-affected harmful factorsVSProductivity

Solution Approach 1:

The patent maintains continuous environmental protection for substrates throughout the entire processing workflow. The inert atmosphere and environmental control systems remain active during substrate loading, transit, processing, and unloading operations, eliminating the need to break the protective environment and re-establish it at each stage, thereby maintaining productivity while ensuring continuous protection.

Inventive Principle:

Principle #20Continuity of useful action

Solution Approach 2:

The patent combines the substrate containment function with the environmental control function into an integrated system. The substrate carrier and factory interface chamber are designed to simultaneously provide physical protection and environmental regulation, eliminating the need for separate protection steps and reducing overall processing time while maintaining substrate quality.

Inventive Principle:

Principle #5Merging (Combining)

Data Source

PatentUS11782404B2Substrate processing systems, apparatus, and methods with substrate carrier and purge chamber environmental controls

Publication Date: 2023.10.10 APPLIED MATERIALS INC

AI summary

A system comprises a factory interface (FI) comprising an FI chamber and a carrier purge chamber, the FI configured to receive a substrate carrier that becomes coupled to the FI such that the carrier purge chamber is positioned between the FI chamber and the substrate carrier, the substrate carrier comprising a carrier door. The system further comprises an environmental control system coupled to at least one of the FI chamber or the carrier purge chamber and configured to couple to the substrate carrier, the environmental control system operable to separately control environmental conditions within at least one of: the carrier purge chamber and the substrate carrier; the carrier purge chamber and the FI chamber; or the FI chamber and the substrate carrier, while the carrier door of the substrate carrier is closed.