Substrate Carrier Shielding Segments for CVD
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Solution Overview
Problem
Existing substrate carrier assemblies for chemical vapor deposition (CVD) processes suffer from contamination and reduced lifespan due to unwanted deposition on non-substrate areas and material deformation caused by interlocking pins with different thermal characteristics.
Innovation Solution
The use of monolithic interlocking elements, such as dents and bulges, on the substrate carrier and shielding segments eliminates the need for separate pins, providing a self-aligning and stress-free attachment that maintains positioning during rotation, while allowing for a controlled gap for cooling gas transport.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If a substrate carrier with a continuous shielding structure is used, then electromagnetic shielding is improved, but particle contamination increases due to accumulation in recesses
Solution Approach 1:
The continuous shielding structure is divided into multiple discrete shielding segments that can be individually removed and cleaned. Each segment is separated from the others, allowing particles to be easily removed without accumulating in recesses between connected shielding elements.
2Object-affected harmful factors
If a substrate carrier with integrated shielding is used, then electromagnetic protection is improved, but cleaning accessibility worsens
Solution Approach 1:
The shielding structure is segmented into removable sections that can be detached from the substrate carrier body. This segmentation provides direct access to all shielding surfaces for cleaning, eliminating recesses that would otherwise be difficult to reach.
Solution Approach 2:
The shielding segments are extracted as separate removable components from the integrated structure. This allows the shielding elements to be taken out for external cleaning using standard cleaning tools and methods, significantly improving cleaning accessibility.
3Object-affected harmful factors
If a substrate carrier with recesses for shielding is used, then electromagnetic shielding is improved, but particle accumulation increases
Solution Approach 1:
The shielding structure is divided into discrete segments rather than forming continuous recesses. This segmentation eliminates particle-trapping corners and recesses, allowing particles to be easily removed from flat, accessible surfaces.
Solution Approach 2:
The design converts the potential harm of recesses (which trap particles) into a benefit by creating a flat, segmented structure where shielding functionality is maintained without creating particle accumulation zones. The segments can be removed for cleaning, turning a potential contamination source into a cleanable surface.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enhances the lifespan of the substrate carrier by preventing contamination and material deformation, reducing material stress, and optimizing temperature conditions, thus improving the semiconductor deposition process efficiency.
Implementation Method 1
said interlocking means consist of at least one pair of cooperating first and second interlocking elements, the first interlocking element forming a monolithic part with said substrate carrier and the second interlocking element forming a monolithic part with said one or more shielding segments
Implementation Method 2
allowing for a controlled gap for cooling gas transport
Data Source
Figure 1a
Figure 1b
Figure 2a
AI summary
The invention relates to a substrate carrier assembly for use in a system for growing epitaxial layers on semiconductor substrates by chemical vapor deposition, said substrate carrier assembly comprising a substrate carrier having a first surface side, an area part of said first surface being provided with recessed pockets for accommodating - during use -said semiconductor substrates,as well as one or more shielding segments configured as removable-positioned plate shaped elements having a covering surface side for substantially covering the remaining area part of said first surface neighboring said pockets, as well as interlocking means for interlocking said one or more shielding segments with said substrate carrier. Moreover the invention also relates to a substrate carrier as well as a shielding segment for use in such substrate carrier assembly.