Substrate Carrier Assembly for Quadrangle Wafer Processing
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Solution Overview
Problem
Existing technologies face challenges in efficiently processing array substrates in a quadrangle shape due to insufficient commercial equipment, leading to significant material loss and reduced productivity when transitioning to a circular wafer form, hindering mass production.
Innovation Solution
A substrate carrier with a guide unit and supporting unit, configured to accommodate and fix a target substrate, allowing for precise alignment and fixation, minimizing material loss and enhancing productivity by facilitating the transition from a quadrangle shape to a circular wafer process.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If array substrates in quadrangle shape are processed using typical wafer processing equipment, then the substrates can be manufactured with fine and complicated implementation, but considerable area loss is generated and productivity is lowered
Solution Approach 1:
The invention divides the quadrangle-shaped array substrate into multiple smaller substrates by forming separation grooves between adjacent substrates. This segmentation allows the large quadrangle substrate to be processed as if it were a circular wafer, enabling the use of standard wafer processing equipment while maintaining manufacturing precision and avoiding considerable area loss.
Solution Approach 2:
The invention introduces a new dimensional approach by creating a circular arrangement of substrates within the quadrangle-shaped array substrate. By viewing the substrate array from a top-down perspective and organizing substrates in a circular pattern with separation grooves, the invention enables compatibility with circular wafer processing equipment while maintaining the quadrangle outer shape for efficient space utilization.
2Adaptability or versatility
If array substrates in quadrangle shape are converted to circular wafer form, then compatibility with typical equipment is improved, but material loss increases and costs rise
Solution Approach 1:
The invention segments the quadrangle-shaped array substrate into individual substrates separated by grooves, allowing each substrate to be processed independently. This segmentation enables the use of standard circular wafer equipment without converting the overall quadrangle shape to circular, thereby eliminating material loss that would occur from reshaping while maintaining equipment compatibility.
Solution Approach 2:
The invention creates a universal processing solution where the separation groove structure enables quadrangle-shaped array substrates to be processed using standard circular wafer equipment. The groove-based separation system serves multiple functions: enabling equipment compatibility, preventing material loss, and facilitating individual substrate extraction after processing.
3Ease of manufacture
If commercial equipment is used to process array substrates, then processing capability is limited, but development and maintenance costs are reduced
Solution Approach 1:
The invention uses segmentation to enable standard commercial equipment to process complex array substrates. By dividing the array substrate into smaller units with separation grooves, the invention allows existing equipment to handle what would otherwise require specialized complex processing systems, thereby reducing development and maintenance costs while maintaining processing capability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The substrate carrier system effectively reduces material loss and costs while improving productivity by enabling seamless integration of quadrangle-shaped substrates into wafer-level packaging processes.
Implementation Method 1
The supporting unit may include an ultraviolet (UV) curable adhesive layer, and the fixing unit comprises a UV curable adhesive material.
Data Source
AI summary
A substrate carrier and a substrate assembly comprising the same are provided. The substrate carrier comprises an accommodation space; a guide unit disposed adjacent to the accommodation space; and a supporting unit disposed under the accommodation space and the guide unit. The guide unit comprises a circular shape or an arc shape in the circumference when viewed from an upper position.