Perimeter Frame Substrate Carrier for Heating Warpage Control
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Solution Overview
Problem
Existing substrate carriers fail to effectively prevent warpage of organic substrate panels during heating operations, leading to uneven temperature profiles and variations in adhesion force between semiconductor die and the substrate, which can result in random failures of packaged semiconductor die.
Innovation Solution
A substrate carrier with a frame having an inner perimeter smaller than the substrate panel and an outer perimeter larger than the panel, featuring an edge or shoulder that rests against the panel to prevent warpage, and optionally including rotatable projections to further secure the panel.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a traditional substrate carrier is used during heating operations, then the substrate panel can be easily handled and positioned, but warpage occurs leading to uneven temperature profiles and adhesion force variations
Solution Approach 1:
The patent transitions from point-contact or edge-contact carriers to a frame carrier that contacts the substrate panel along its entire perimeter (adding dimensional coverage). This perimeter-based contact approach distributes support forces uniformly across the substrate edges, preventing warpage while maintaining even temperature distribution during heating operations.
Solution Approach 2:
The frame carrier is divided into multiple segments or sections along the perimeter, allowing each segment to independently contact and support specific portions of the substrate panel edges. This segmentation enables uniform distribution of support forces throughout the perimeter, effectively preventing warpage without creating stress concentration points.
2Reliability
If the frame carrier contacts the substrate panel at multiple points along the perimeter, then warpage is prevented, but the device complexity increases
Solution Approach 1:
The frame carrier employs a thin, flexible yet rigid enough structure that can elastically conform to the substrate panel perimeter while maintaining contact. This flexible frame design achieves stable substrate support through its overall geometry rather than complex mechanical components, reducing device complexity while ensuring reliability.
3Manufacturing precision
If existing substrate carriers are used, then handling is simplified, but adhesion force consistency between semiconductor die and substrate deteriorates
Solution Approach 1:
The frame carrier acts as an intermediary support structure that contacts only the substrate panel perimeter, not the semiconductor die or the substrate center. This intermediary positioning allows uniform heat distribution and consistent adhesion force development across the substrate-die interface without interfering with the bonding process, while the frame's geometry provides stable handling capability.
Data Source
AI summary
Implementations of a substrate carrier may include a frame including an inner perimeter, the inner perimeter configured to be smaller than a perimeter of an organic substrate panel including multiple semiconductor die coupled thereto; and an outer perimeter configured to be larger than the perimeter of the organic substrate panel; wherein an edge of the frame between the inner perimeter and outer perimeter may be configured to rest against the organic substrate panel to prevent warpage during a heating operation.