Substrate Carrying Mode Switching for Defect Isolation
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Solution Overview
Problem
Existing substrate processing systems face challenges in identifying defective modules during the resist film forming process, leading to inefficiencies and reduced throughput when processing a large number of substrates, as the flexible carrying mode makes it difficult to determine which module caused a defect and results in longer carrying distances.
Innovation Solution
A substrate processing system and method that employs two carrying modes: a flexible mode for initial processing and a permanent assignment mode for identifying defective modules, allowing for efficient defect detection and maintaining high throughput by permanently assigning receiving modules to sending modules under specific conditions, including preferential selection of inoperative modules.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If a flexible carrying mode is used to process a large number of substrates, then productivity is improved, but it becomes difficult to identify defective modules and carrying distance increases
Solution Approach 1:
The system dynamically switches between flexible carrying mode (for high throughput) and fixed assignment mode (for defect detection). The control unit changes the carrying mode based on operational requirements, allowing the system to adapt its behavior to prioritize either productivity or defect identification as needed
2Productivity
If a flexible carrying mode is used to process a large number of substrates, then productivity is improved, but carrying distance increases leading to time loss
Solution Approach 1:
The system dynamically adjusts carrying routes by switching between flexible mode (optimizing for throughput) and fixed assignment mode (minimizing carrying distance). This dynamic adjustment allows the system to reduce unnecessary carrying movements while maintaining high productivity
3Measurement precision
If permanent assignment mode is used for defect identification, then measurement precision is improved, but productivity decreases
Solution Approach 1:
The system periodically switches to fixed assignment mode for defect detection purposes, then returns to flexible mode for high-throughput processing. This periodic alternation allows the system to maintain measurement precision for defect identification while preserving overall productivity through the majority of operation time spent in flexible mode
Data Source
AI summary
A substrate processing system processes a plurality of substrates in a single-substrate processing mode by a plurality of processes and provided with a plurality of modules respectively for carrying out processes. When a defect is found in a substrate, a defective processing unit that caused the defect can be easily found out. The substrate processing system and a substrate processing method to be carried out by the substrate processing system can suppress the reduction of throughput when a large number of substrates are to be processed. The substrate processing system is provided with a plurality of modules for processing a plurality of substrates (W) in a single-substrate processing mode by a plurality of processes and includes a substrate carrying means (A4) for carrying a substrate (W) from a sending module to a receiving module, and a control means (6) for controlling the substrate carrying means (A4) on the basis of one of at least two carrying modes each assigning receiving modules to sending modules. The control means (6) changes the carrying mode in effect for the other carrying mode upon the reception of a carrying mode change command while substrates are being processed and makes the substrate carrying means (A4) carry substrates in the carrying mode newly brought into effect.