Substrate Loading Cassette With Vibration Damping and Sag Support
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Solution Overview
Problem
Glass substrates for semiconductor packaging are vulnerable to vibration and impact during transfer, leading to potential damage and sagging due to their thin and large-area nature, which is exacerbated in densely packed environments.
Innovation Solution
A substrate loading cassette with a support frame, vibration damping portion, and slip prevention features, including polyamide resin and adjustable mechanical properties, to stabilize and protect glass substrates during transfer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If glass substrates are loaded in a densely packed cassette for efficient transfer, then productivity is improved, but the substrates become more vulnerable to vibration and impact damage
Solution Approach 1:
The patent applies beforehand cushioning by introducing a vibration damping portion made of polyamide resin between the transfer device coupling frame and the support frame. This damping portion is positioned in advance to absorb and attenuate vibrations and impacts during cassette transfer, protecting the densely packed glass substrates from damage while maintaining high transfer efficiency
Solution Approach 2:
The patent employs composite materials by using polyamide resin for the vibration damping portion, which combines the properties of structural support with vibration attenuation. The polyamide resin provides both mechanical strength to maintain cassette integrity and damping characteristics to protect substrates, enabling dense packing without compromising substrate reliability
2Productivity
If large-area glass substrates are placed in the cassette, then the packaging capability is improved, but sagging occurs due to the weight of the substrates
Solution Approach 1:
The patent applies local quality by strategically positioning support bars at specific locations within the cassette - connected to the support frame and extending inwardly to contact and support the glass substrates. This localized support structure distributes the weight of large-area substrates, preventing sagging while maintaining the ability to package multiple substrates efficiently
3Ease of manufacture
If the cassette structure is simplified for ease of manufacture, then manufacturing cost is reduced, but vibration damping performance deteriorates
Solution Approach 1:
The patent introduces an intermediary element - the vibration damping portion made of polyamide resin - between the rigid transfer device coupling frame and the support frame. This intermediary component serves as a mediator that absorbs vibrations and impacts, protecting substrates without requiring complex structural modifications to the cassette itself, thus maintaining ease of manufacture while improving vibration damping performance
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The cassette effectively reduces substrate damage and sagging by damping vibrations and preventing slippage, ensuring stable and efficient transfer of glass substrates.
Implementation Method 1
a vibration damping portion disposed under the transfer device coupling frame
Implementation Method 2
The vibration damping portion includes polyamide resin
Implementation Method 3
The support bar has a modulus of elasticity of 0.03 MPa to 0.5 MPa
Implementation Method 4
The slip prevention portion may have a coefficient of friction higher than the coefficient of friction of the vibration damping portion
Data Source
AI summary
Disclosed is a substrate loading cassette including an upper frame, a lower frame disposed to face the upper frame, a support frame configured to connect the upper frame and the lower frame to each other at an edge side of the substrate loading cassette, a transfer device coupling unit disposed on the upper frame, the transfer device coupling unit being coupled to a transfer device configured to transfer the substrate loading cassette, wherein the transfer device coupling unit includes a transfer device coupling frame and a vibration damping portion disposed under the transfer device coupling frame, the support frame includes a first support frame disposed on each of left and right sides of the substrate loading cassette and a second support frame disposed on a rear side of the substrate loading cassette, and the substrate loading cassette includes a support bar connected to the second support frame.