Substrate Cavity Alignment for Optical Connector Precision
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Solution Overview
Problem
Legacy semiconductor packaging methods for optical coupling, such as active alignment and V-groove based passive alignment, are complex and costly, leading to increased assembly time and manufacturing challenges, particularly in high-volume production, due to the need for separate receptacle components and adhesive materials.
Innovation Solution
A substrate cavity with alignment features, including pedestal structures, is used to accurately align a fiber attach unit (FAU) lens with a photonics integrated circuit (PIC) lens, eliminating the need for separate receptacle components and simplifying the alignment process, thereby reducing assembly costs and improving alignment precision.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If separate receptacle components and adhesive materials are used for optical coupling, then alignment can be achieved, but device complexity and manufacturing cost increase
Solution Approach 1:
The patent merges the receptacle component and substrate into a single integrated substrate structure. The cavity is formed directly in the substrate, and alignment features are incorporated into the substrate cavity walls, eliminating the need for separate receptacle components and adhesive materials while maintaining alignment precision between optical components.
2Manufacturing precision
If active alignment procedures are used, then alignment precision is improved, but assembly time and manufacturing cost increase
Solution Approach 1:
The patent implements preliminary action by pre-forming alignment features (such as alignment pins, grooves, or protrusions) on the substrate cavity walls during substrate manufacturing. This preliminary preparation enables passive alignment during assembly, eliminating the need for time-consuming active alignment procedures and adhesive application steps, thereby improving both alignment precision and assembly speed.
3Productivity
If V-groove based passive alignment is used, then assembly time is reduced, but alignment precision and manufacturing complexity increase
Solution Approach 1:
The patent applies local quality by incorporating specific alignment features at critical locations within the substrate cavity. Rather than relying on complex V-groove structures, the alignment features are strategically positioned on the cavity walls to provide precise localization and orientation for optical components, achieving high alignment precision with simpler manufacturing.
Data Source
AI summary
Embodiments described herein may be related to apparatuses, processes, and techniques related to a cavity created in a package substrate, where the surface of the substrate at the bottom of the cavity, or alignment features at the surface of the substrate at the bottom of the cavity are used to accurately align a lens of a FAU to a lens of a PIC. In embodiments, the surface of the substrate at the bottom of the cavity has additional standoff pedestal features to aid in height tolerance control of the FAU to properly align the FAU lens when attached. Other embodiments may be described and/or claimed.