Substrate Cavity Bridge Attach for Low Z-Height Package Routing

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Solution Overview

Problem

Existing microelectronic packages with external bridges often lack surface routing on top of the bridge, leading to manufacturing challenges and increased z-height, which can be costly and difficult to manufacture.

Innovation Solution

The substrate material over the N-1 layer is patterned to form openings exposing the N-1 layer, allowing for power or I/O routing. Solder bumps are placed in these openings to physically and communicatively couple the bridge with components, enabling tight-pitch connections without significant added manufacturing steps.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If external bridges are used to connect microelectronic package elements, then connectivity between elements is achieved, but the z-height increases and manufacturing complexity increases

Engineering Contradiction:

ImproveconnectivityVSAvoidz-height

Core Design Contradiction:

ReliabilityVSLength of stationary object

Solution Approach 1:

The bridge is moved from an external structure to an internal structure embedded within the substrate layers. The bridge is formed in the substrate between conductive vias, transitioning the bridge placement from the vertical dimension (external, increasing z-height) to the horizontal/planar dimension (internal, within substrate layers), thereby reducing package height while maintaining connectivity.

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

Solution Approach 2:

The bridge is nested within the substrate structure, specifically formed in the substrate between conductive vias that connect to different layers. This nesting approach integrates the bridge into the existing substrate architecture rather than adding it as an external component, reducing overall package complexity and z-height.

Inventive Principle:

Principle #7Nested doll (Nesting)

2Adaptability or versatility

If external bridges are used with surface routing, then routing flexibility is improved, but manufacturing complexity and cost increase

Engineering Contradiction:

Improverouting flexibilityVSAvoidmanufacturing complexity

Core Design Contradiction:

Adaptability or versatilityVSDevice complexity

Solution Approach 1:

The substrate structure serves multiple functions: it provides mechanical support, electrical routing through conductive vias, and housing for the bridge element. The conductive vias and substrate layers are designed to accommodate both the bridge connection and signal routing simultaneously, eliminating the need for separate surface routing structures and reducing manufacturing complexity.

Inventive Principle:

Principle #6Universality (Multi-functionality)

Solution Approach 2:

The bridge connection structure is merged with the substrate routing structure. The conductive vias that would traditionally be used for simple connections are instead integrated to provide both bridge attachment and signal routing functions, combining multiple functions into a single integrated structure that reduces manufacturing steps.

Inventive Principle:

Principle #5Merging (Combining)

Data Source

PatentUS12272650B2Microelectronic package with substrate cavity for bridge-attach

Publication Date: 2025.04.08 INTEL CORP

AI summary

Embodiments may relate to a microelectronic package that includes a substrate with a cavity therein. A component may be positioned within the substrate, and exposed by the cavity. A solder bump may be positioned within the cavity and coupled with the component, and a bridge die may be coupled with the solder bump. Other embodiments may be described or claimed.