Semiconductor Substrate Cavity Layout to Prevent Component Shift

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Solution Overview

Problem

The position of electronic components within a semiconductor device package can shift during the filling of insulation material, adversely affecting the reliability and performance of the package.

Innovation Solution

Divide electronic components into groups, encapsulating each group in a component module, and then encapsulate these modules with a first insulation layer, followed by a second insulation layer that fills the cavity, thereby improving yield and reducing position shifts.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If insulation material is filled into the cavity to encapsulate electronic components, then the electronic components are protected and encapsulated, but the position of the electronic components may shift during the filling process

Engineering Contradiction:

Improveencapsulation protectionVSAvoidposition accuracy

Core Design Contradiction:

ReliabilityVSManufacturing precision

Solution Approach 1:

The patent divides the cavity into multiple sub-cavities using partition walls, and groups electronic components into separate component modules. Each module is encapsulated independently within its own sub-cavity, preventing position shifts during the insulation material filling process while maintaining protection and encapsulation effectiveness.

Inventive Principle:

Principle #1Segmentation

2Adaptability or versatility

If electronic components are individually placed in the cavity, then flexibility in component arrangement is achieved, but position shifts occur during insulation material filling

Engineering Contradiction:

Improvecomponent arrangement flexibilityVSAvoidposition stability

Core Design Contradiction:

Adaptability or versatilityVSManufacturing precision

Solution Approach 1:

The patent performs preliminary grouping of electronic components into component modules before placing them in the cavity. Each module is pre-assembled with its components in a fixed configuration, and then the entire module is placed as a unit in the cavity. This preliminary action ensures position stability during insulation material filling while still allowing flexibility in the overall arrangement of different module types.

Inventive Principle:

Principle #10Preliminary action

3Manufacturing precision

If all electronic components are grouped into fewer component modules, then position stability improves during filling, but the complexity of module design increases

Engineering Contradiction:

Improveposition stabilityVSAvoidmodule design complexity

Core Design Contradiction:

Manufacturing precisionVSDevice complexity

Solution Approach 1:

The patent applies different grouping strategies to different regions or types of electronic components based on their specific requirements. Components with similar functions or connection requirements are grouped together in specific modules, while other components are arranged differently. This localized approach to module design maintains position stability during filling without unnecessarily increasing overall system complexity.

Inventive Principle:

Principle #3Local quality

Data Source

PatentUS12463141B2Semiconductor substrate, semiconductor package, method of manufacturing the same

Publication Date: 2025.11.04 ADVANCED SEMICON ENG INC

AI summary

A semiconductor substrate includes a substrate and a plurality of electronic components. The substrate defines a cavity. A total number of the electronic components is N, the electronic components are divided into M groups, M and N are positive integers, and M is smaller than N. The electronic components in each group are encapsulated by a first insulation layer to form a respective component module. Each of the component modules is disposed in the cavity. A second insulation layer fills the cavity and encapsulates the component modules.