Substrate Cavity Alignment for Pluggable Optical Connectors
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Solution Overview
Problem
Efficiently and cost-effectively aligning optics to couple light into and out of photonic integrated circuits (PICs) is challenging due to slow and incompatible attachment methods, leading to yield and throughput issues in conventional semiconductor packaging processes.
Innovation Solution
A connectorized optical cable with an optical plug featuring a ferrule and alignment features is used, which plugs into an optical socket with a cavity in the substrate, providing sub-micron precision alignment and simplifying processing by reducing the number of components required.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If conventional attachment methods are used to align optics to PICs, then optical coupling can be achieved, but the process is slow and results in substantial yield and throughput issues
Solution Approach 1:
The patent applies preliminary action by pre-forming alignment features (such as grooves, ridges, or asymmetric structures) directly into the substrate during the semiconductor fabrication process, before the actual optical assembly takes place. This pre-prepared alignment infrastructure enables rapid and precise positioning of optical components without requiring time-consuming manual adjustment or complex alignment mechanisms during assembly, thereby simultaneously improving throughput and alignment precision.
2Manufacturing precision
If additional components are used to achieve precise alignment, then alignment accuracy improves, but device complexity and processing steps increase
Solution Approach 1:
The patent merges the alignment function directly into the substrate by integrating alignment features (such as grooves, ridges, or asymmetric patterns) as part of the substrate structure itself during fabrication. This eliminates the need for separate alignment components or mechanisms, reducing device complexity while maintaining high alignment precision. The substrate simultaneously serves as both the mounting platform and the alignment reference.
Solution Approach 2:
The substrate is designed to perform multiple functions: it serves as the mechanical support for optical components, the electrical connection medium, and the alignment reference. By embedding alignment features directly into the substrate structure, the same component (substrate) fulfills multiple roles, eliminating the need for dedicated alignment components and simplifying the overall device architecture.
3Ease of manufacture
If conventional semiconductor packaging processes are used for optical fiber array attachment, then standard manufacturing can be utilized, but the process is incompatible and results in yield issues
Solution Approach 1:
The patent applies parameter changes by modifying the substrate structure to include specific alignment features (such as grooves, ridges, or asymmetric patterns) that are formed during standard semiconductor fabrication processes. These structural parameter changes enable the substrate to provide precise mechanical alignment without requiring non-standard or complex assembly processes, thereby maintaining compatibility with conventional manufacturing while improving yield through more robust and repeatable alignment.
Data Source
AI summary
Technologies for substrate features for a pluggable optical connectors in an integrated circuit package are disclosed. In the illustrative embodiment, a substrate includes a cavity cut through a substrate of the integrated circuit package. Sidewalls of the cavity establish coarse lateral alignment features for an optical plug. The optical plug and optical socket include additional alignment features to more precisely align optical fibers in the optical plug to an optical interposer mounted on the substrate. The cavity cut through the substrate may also include indents that can mate with protrusions of the optical plug to retain the optical plug. The optical interposer may be mounted on a recessed shelf in the substrate.