Semiconductor Substrate Cavity Packaging for Component Position Stability

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Solution Overview

Problem

The position of electronic components within a semiconductor device package can shift during the filling of insulation material, affecting the reliability and performance of the package.

Innovation Solution

Divide electronic components into groups, encapsulate each group in a component module, and fill the cavity with a second insulation layer to encapsulate these modules, improving yield and reducing position shifts.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If electronic components are individually placed in the cavity and insulation material is filled, then the cavity can be fully encapsulated, but the position of electronic components shifts during filling

Engineering Contradiction:

Improveposition stabilityVSAvoidmanufacturing process complexity

Core Design Contradiction:

ReliabilityVSEase of manufacture

Solution Approach 1:

The patent divides electronic components into multiple groups and forms separate component modules for each group. Each module is independently encapsulated with insulation material before being placed in the cavity. This segmentation prevents position shifts during cavity filling while simplifying the manufacturing process through modular assembly.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The patent performs preliminary encapsulation of electronic components into component modules before placing them in the final cavity. The insulation material is applied to each component group in advance, forming stable modules that resist position shifts during subsequent cavity filling operations.

Inventive Principle:

Principle #10Preliminary action

2Reliability

If electronic components are divided into groups and encapsulated separately, then position stability improves, but the number of encapsulation layers increases

Engineering Contradiction:

Improveposition stabilityVSAvoidinsulation layer structure

Core Design Contradiction:

ReliabilityVSDevice complexity

Solution Approach 1:

The patent implements a nested insulation structure where the first insulation layer encapsulates individual electronic components within component modules, and the second insulation layer encapsulates multiple component modules together in the cavity. This nested approach provides positional stability while organizing complexity in a hierarchical manner.

Inventive Principle:

Principle #7Nested doll (Nesting)

3Productivity

If component modules are used to reduce position shifts, then manufacturing yield increases, but the manufacturing process steps increase

Engineering Contradiction:

Improvemanufacturing yieldVSAvoidprocess steps

Core Design Contradiction:

ProductivityVSDevice complexity

Solution Approach 1:

The patent segments the manufacturing process into modular steps: forming component modules with insulation material, placing multiple modules in the cavity, and performing final encapsulation. This segmentation improves manufacturing yield by allowing independent verification and handling of each module while organizing process steps in a systematic sequence.

Inventive Principle:

Principle #1Segmentation

Data Source

PatentUS20260068706A1Semiconductor substrate, semiconductor package, method of manufacturing the same

Publication Date: 2026.03.05 ADVANCED SEMICON ENG INC

AI summary

A semiconductor substrate includes a substrate and a plurality of electronic components. The substrate defines a cavity. A total number of the electronic components is N, the electronic components are divided into M groups, M and N are positive integers, and M is smaller than N. The electronic components in each group are encapsulated by a first insulation layer to form a respective component module. Each of the component modules is disposed in the cavity. A second insulation layer fills the cavity and encapsulates the component modules.