Substrate Chamber Temperature Control Using Dual-Media Flow Ratios
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Solution Overview
Problem
Conventional semiconductor wafer processing apparatuses face challenges with increased installation costs, energy consumption, and maintenance complexity due to the need for multiple chillers to control temperatures independently in multiple processing modules, while existing solutions using a single chiller can only maintain a single temperature across all modules.
Innovation Solution
A substrate processing apparatus utilizing a dual chiller system with flow controllers to independently control the ratio of two temperature-controlling media, allowing each processing module to achieve required temperatures, thereby reducing the need for multiple chillers and minimizing energy consumption.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If multiple chillers are used to independently control temperature in multiple processing modules, then temperature control independence is improved, but installation cost and device complexity increase
Solution Approach 1:
The single chiller is segmented into multiple circulation paths, with each path independently controlling a specific processing module. Flow controllers divide the coolant flow to different modules, enabling independent temperature control without requiring multiple separate chillers. This segmentation of the cooling system resolves the contradiction by maintaining temperature control independence while reducing the number of chillers.
Solution Approach 2:
A single chiller is designed to serve multiple processing modules simultaneously through a multi-path circulation system. The chiller performs the universal function of cooling multiple modules independently by distributing coolant through controlled circulation paths. This multi-functionality approach allows one chiller to replace what would traditionally require multiple chillers.
2Measurement precision
If multiple chillers are deployed for independent temperature control, then temperature control precision is improved, but energy consumption increases
Solution Approach 1:
Multiple separate chiller systems are merged into a single integrated chiller with multiple circulation paths. This consolidation maintains the temperature control precision needed for each module while eliminating the redundant energy consumption of operating multiple separate chillers. The merged system shares common components and control mechanisms, reducing overall energy usage.
3Device complexity
If a single chiller serves multiple processing modules, then device complexity is reduced, but temperature control adaptability deteriorates
Solution Approach 1:
The circulation system incorporates dynamic flow controllers that can independently adjust coolant flow rates to each processing module in real-time. This dynamic control capability enables each module to receive precisely the cooling it needs independently, maintaining temperature control adaptability despite using a single static chiller unit. The dynamics are introduced at the flow distribution level rather than at the chiller level.
4Reliability
If multiple chillers are used, then maintenance complexity increases, but reliability of temperature control is improved
Solution Approach 1:
Multiple chiller systems are merged into one integrated chiller with modular circulation paths. This consolidation reduces maintenance complexity by eliminating redundant components and simplifying the overall system architecture. The single chiller design means fewer units to maintain, while the modular circulation paths preserve the reliability needed for independent temperature control of each module.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enables independent temperature control of multiple processing modules using a single chiller, reducing installation costs, energy consumption, and simplifying maintenance, while improving thermal responsiveness and reducing the time required for temperature adjustments.
Implementation Method 1
a chiller to supply a first temperature-controlling medium with a first flow rate and a second temperature-controlling medium with a second flow rate into the target components
Data Source
AI summary
A system of processing a substrate includes substrate-processing chambers; target components of temperature control disposed in the respective substrate-processing chambers; a chiller to supply a first temperature-controlling medium with a first flow rate and a second temperature-controlling medium with a second flow rate into the target components; flow controllers connected to the respective target components, each flow controller being configured to independently control a ratio of the first flow rate to the second flow rate to be fed into the corresponding target component from the chiller.


