Substrate Chamber Sensing for Supercritical Fluid Cleaning Control
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Solution Overview
Problem
The challenge in using supercritical fluids for cleaning substrates is the difficulty in controlling conditions such as fluid supply, release, and temperature distribution, which affects process performance and pattern formation during semiconductor manufacturing.
Innovation Solution
A substrate treating apparatus with a process chamber, a support unit, a fluid supply unit, and a measurement unit that includes temperature sensors and a communication module, allowing for real-time monitoring and feedback control of temperature and pressure within the chamber.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a supercritical fluid is used in a cleaning apparatus, then cleaning capability is improved, but control of process conditions becomes difficult
Solution Approach 1:
The patent implements feedback control by measuring the actual temperature distribution within the supercritical fluid using temperature sensors and comparing it with the target temperature distribution. The controller adjusts the heating power distribution based on this feedback to maintain accurate temperature control, thereby enabling reliable cleaning while improving ease of operation.
Solution Approach 2:
The patent replaces manual control of process conditions with an automated control system that uses temperature sensors, a controller, and adjustable heating means. This substitution of mechanical/manual control with an automated feedback-based system resolves the contradiction by making the supercritical fluid cleaning process both effective and easy to control.
2Device complexity
If temperature distribution of supercritical fluid is not monitored, then apparatus complexity is reduced, but process performance deteriorates
Solution Approach 1:
The patent introduces a feedback-based temperature monitoring and control system that measures actual temperature distribution in the supercritical fluid and adjusts heating accordingly. This feedback mechanism ensures high process performance while keeping the system design practical and manageable.
Solution Approach 2:
The controller performs multiple functions: it manages the heating means, processes temperature data from sensors, calculates target temperature distributions, and adjusts heating power dynamically. This multi-functionality consolidates complexity into a single control unit, maintaining device simplicity while ensuring high manufacturing precision.
3Adaptability or versatility
If temperature distribution is changed depending on internal pressure change, then supercritical fluid behavior is optimized, but pattern leaning phenomenon increases
Solution Approach 1:
The patent uses real-time temperature measurement and feedback control to monitor and adjust the temperature distribution in the supercritical fluid. By maintaining the temperature within an optimal range despite pressure changes, the system prevents pattern leaning while preserving the benefits of pressure-dependent supercritical fluid behavior.
Solution Approach 2:
The patent actively manages temperature as a controllable parameter, adjusting it dynamically based on feedback from temperature sensors. This parameter control compensates for the effects of pressure changes on supercritical fluid behavior, preventing pattern leaning while maintaining adaptability of the fluid to different processing conditions.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution improves cleaning efficiency by enabling precise monitoring and control of the cleaning process, optimizing conditions for effective substrate treatment using supercritical fluids.
Implementation Method 1
the measurement unit may include temperature sensors
Implementation Method 2
a process chamber having a process space in which the substrate is treated with a fluid in a supercritical state
Data Source
AI summary
The inventive concept relates to an apparatus for treating a substrate. In an embodiment, the apparatus includes a process chamber having a process space in which the substrate is treated with a fluid in a supercritical state, a support unit that supports the substrate in the process space, a fluid supply unit that supplies the fluid into the process space, a filler member disposed to face the substrate placed on the support unit in the process space, and a measurement unit that measures a state in the process space, the measurement unit being provided in the filler member.