Substrate Processing Chamber Venting for Residue-Free Supercritical Drying
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Solution Overview
Problem
Contaminants such as organic solvents and particles remain in the supercritical-treated chamber and common pipes, leading to substrate contamination during the drying process in semiconductor manufacturing.
Innovation Solution
A substrate processing apparatus and method that includes a discharge step to exhaust the atmosphere through a common pipe, followed by pressurization using treatment fluid, treatment in a supercritical state, and depressurization to minimize residue contamination.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If a common pipe is used to simultaneously supply treatment fluid and exhaust atmosphere, then device complexity is reduced, but residues remain in the pipe causing substrate contamination
Solution Approach 1:
The common pipe is divided into two separate pipes: a supply line for introducing treatment fluid and an exhaust line for discharging atmosphere. This segmentation prevents residue accumulation that would occur in a shared pipe, thereby eliminating the source of substrate contamination while maintaining operational efficiency.
Solution Approach 2:
The exhaust function is extracted from the supply line by dedicating a separate exhaust line for atmosphere discharge. This extraction ensures that residues are removed through the specialized exhaust line rather than remaining in the supply line, preventing contamination of subsequent treatment fluid and substrates.
2Productivity
If treatment fluid is continuously supplied through the same pipe used for exhaust, then process efficiency is improved, but residues contaminate the supply line
Solution Approach 1:
The fluid transport system is segmented into separate supply and exhaust lines, allowing continuous efficient operation of the supply line without contamination from exhaust residues. Each line can be optimized for its specific function while preventing cross-contamination.
Solution Approach 2:
The exhaust function is extracted into a dedicated line, preventing residues from entering the supply line. This extraction maintains high processing efficiency while ensuring the supply line remains clean and reliable for continuous treatment fluid delivery.
3Loss of time
If residues are not discharged from the treatment space, then process time is reduced, but contaminants remain on substrates
Solution Approach 1:
Residues and contaminants are extracted from the treatment space through the dedicated exhaust line during the exhaust phase. This extraction mechanism ensures thorough removal of contaminants while maintaining an efficient process cycle, preventing substrate contamination without excessive process time.
Solution Approach 2:
The exhaust line is designed to remove residues before they can contaminate substrates during subsequent treatment phases. This preliminary action of residue removal ensures substrate cleanliness is maintained throughout the processing cycle.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Minimizes substrate contamination by effectively discharging residues from the common pipe and treatment space, preventing contamination of the supply line and ensuring clean substrate processing.
Implementation Method 1
a discharge step of discharging an atmosphere in the treatment space after the loading step
Implementation Method 2
a pressurizing step of pressurizing the treatment space by supplying treatment fluid to the treatment space after the discharge step
Implementation Method 3
a treatment step of treating the substrate in the treatment space using a fluid supplied to the treatment space after the pressurizing step
Implementation Method 4
a technique of drying substrates using supercritical liquid when proceeding with a drying process
Implementation Method 5
a depressurizing step of depressurizing the treatment space after the treatment step
Data Source
AI summary
The present invention provides a substrate processing apparatus. In an embodiment, the substrate processing method includes: a loading step of loading a substrate into a treatment space provided in a chamber; a discharge step of discharging an atmosphere in the treatment space after the loading step; a pressurizing step of pressurizing the treatment space by supplying treatment fluid to the treatment space after the discharge step; a treatment step of treating the substrate in the treatment space using a fluid supplied to the treatment space after the pressurizing step; and a depressurizing step of depressurizing the treatment space after the treatment step.