Substrate Drying Chamber Temperature Sensing for Uniform Supercritical Flow
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
The uneven distribution of supercritical fluid in substrate processing containers due to temperature deviations during the semiconductor manufacturing process can lead to defects in substrates, as existing technologies lack effective temperature measurement and control mechanisms to ensure uniform fluid distribution.
Innovation Solution
A substrate processing apparatus equipped with a transfer robot and surface temperature measurement sensors that measure and control the temperature of the substrate processing container, ensuring the substrate is loaded only when the temperature is within a preset reference range, thereby preventing ununiform fluid distribution and potential substrate defects.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If the substrate processing container is heated to create a supercritical environment, then the drying capability is improved, but the temperature distribution becomes uneven causing fluid distribution deviation
Solution Approach 1:
The patent applies preliminary action by measuring the surface temperature of the substrate processing container before loading the substrate. The temperature measurement is performed in advance to determine whether the container has cooled down to an appropriate temperature range, preventing temperature-induced fluid distribution issues before they occur. This ensures that the container temperature is within the optimal range for uniform supercritical fluid distribution.
Solution Approach 2:
The patent implements feedback control by continuously monitoring the surface temperature of the substrate processing container using a temperature measurement sensor. The measured temperature information is fed back to control the heating or cooling of the container, adjusting the temperature to maintain uniform supercritical fluid distribution. This closed-loop control prevents temperature deviations that would cause uneven fluid distribution.
2Productivity
If the substrate processing container temperature increases during repeated drying, then the drying efficiency is improved, but the surface temperature deviation causes defects
Solution Approach 1:
The patent applies preliminary action by measuring the surface temperature of the substrate processing container before each substrate loading operation. This preliminary temperature check ensures that the container has cooled down sufficiently from previous drying cycles, preventing temperature-related substrate defects while maintaining efficient drying when conditions are appropriate.
Solution Approach 2:
The patent implements feedback control by monitoring the container surface temperature and using this information to control substrate loading decisions. When the temperature exceeds the optimal range, the system prevents substrate loading or initiates cooling, thereby preventing defects while allowing efficient drying operations when temperature conditions are favorable.
3Device complexity
If existing temperature measurement methods are used, then the measurement process is simple, but the temperature measurement accuracy is insufficient to prevent fluid distribution issues
Solution Approach 1:
The patent introduces a temperature measurement sensor as an intermediary device that specifically measures the surface temperature of the substrate processing container. This dedicated measurement approach provides accurate temperature data without significantly increasing system complexity, enabling precise control of the supercritical fluid distribution conditions.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution ensures accurate temperature measurement and control, preventing substrate defects caused by ununiform supercritical fluid distribution and maintaining optimal processing conditions, thus enhancing the yield and quality of semiconductor devices.
Implementation Method 1
a surface temperature measurement sensor configured to measure a surface temperature of the substrate processing container
Implementation Method 2
a supercritical drying process of drying the substrate by using supercritical fluid
Implementation Method 3
has excellent diffusivity and water permeability
Implementation Method 4
The supercritical fluid is unevenly distributed due to the deviation in the distribution of the surface temperature
Data Source
AI summary
A substrate processing apparatus includes a substrate cleaning unit cleaning a substrate, a substrate drying unit drying the substrate, and a transfer robot transferring the substrate between the substrate cleaning unit and the substrate drying unit. The substrate drying unit includes a substrate processing container having a substrate processing space accommodating the substrate, and the transfer robot includes a surface temperature measurement sensor measuring a surface temperature of the substrate processing container.