Substrate Channel for IC Encapsulation
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Solution Overview
Problem
The challenge in miniaturizing electronic devices is exacerbated by the difficulty in fully encapsulating passive components, leading to gaps that can cause short circuits during the encapsulation process, particularly as component sizes decrease, and existing solutions have not effectively addressed this issue.
Innovation Solution
A channel is formed in the substrate between contact pads, allowing encapsulant to flow under passive components and prevent air pockets, thereby ensuring complete encapsulation and preventing short circuits.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If passive components are mounted directly on the substrate without channels, then the manufacturing process is simpler, but gaps remain under the components preventing complete encapsulation and causing short circuits
Solution Approach 1:
The substrate is segmented by forming channels that divide the space between contact pads. These channels create defined pathways for encapsulant flow, segmenting the encapsulation process into controlled regions that ensure complete filling while maintaining structural organization.
Solution Approach 2:
Channels are formed extending vertically into the substrate from the front surface, creating a third dimension for encapsulant flow. This vertical dimension allows the encapsulant to access and fill the space under passive components from below, ensuring complete encapsulation that would be difficult to achieve with horizontal filling alone.
2Productivity
If component sizes are reduced to continue miniaturization, then device density increases, but the gap under passive components becomes harder to fill with mold compound
Solution Approach 1:
Channels are formed in the substrate before passive components are mounted. This preliminary action creates pre-defined flow pathways that guide the encapsulant to the spaces under components during the encapsulation process, ensuring complete filling even as component sizes decrease and gaps become more challenging to access.
Solution Approach 2:
The channels act as intermediary structures that mediate between the encapsulant and the space under passive components. These channels provide a controlled interface that directs and facilitates the flow of encapsulant into difficult-to-reach areas, enabling complete encapsulation of miniaturized components.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The channel ensures effective encapsulation of discrete components, preventing short circuits and supporting the trend towards smaller, more compact IC devices while reducing costs and improving performance.
Implementation Method 1
A channel is formed in the substrate between contact pads, allowing encapsulant to flow under passive components and prevent air pockets
Data Source
AI summary
An integrated circuit package system provides a substrate and contact pads are formed on the substrate. A channel is formed in the substrate between the contact pads. A circuit component is electrically connected to the contact pads, with the circuit component over the channel. The circuit component, the contact pads, and the channel are encapsulated in encapsulant, the encapsulant flowing into the channel.