Substrate Surface Charging to Prevent Metal Ion Contamination

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Solution Overview

Problem

Existing substrate processing technologies using ozone gas risk metal contamination due to metal ions from chamber and supply line materials, such as stainless steel, adhering to the substrate.

Innovation Solution

A substrate processing apparatus and method that includes an electrostatic charging unit to positively charge the substrate surface and a gas bake unit to perform heating and gas processing, utilizing insulative materials to minimize contact with metal ions and repel them from the substrate.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Strength

If metal materials (stainless steel) are used for chamber and supply line, then structural strength and durability are improved, but metal ion contamination of substrate occurs

Engineering Contradiction:
Improvestructural strengthVSAvoidmetal ion contamination
Core Design Contradiction:
StrengthVSObject-affected harmful factors

Solution Approach 1:

The patent introduces an electrostatic charger as an intermediary device that generates positive ions to charge the substrate surface. This intermediary mechanism repels metal ions from the chamber and supply line, preventing them from adhering to the substrate while allowing the metal structural components to remain in place

Inventive Principle:
Principle #24Intermediary (Mediator)

Solution Approach 2:

The patent changes the electrical parameter of the substrate surface by applying positive charge through the electrostatic charger. This parameter change creates electrostatic repulsion against metal ions, preventing contamination while maintaining the metal structural integrity of the chamber and supply line

Inventive Principle:
Principle #35Parameter changes

2Manufacturing precision

If ozone gas is supplied to oxidize organic film, then cleaning effectiveness is improved, but metal ion adhesion to substrate increases

Engineering Contradiction:
Improvecleaning effectivenessVSAvoidmetal ion adhesion
Core Design Contradiction:
Manufacturing precisionVSObject-affected harmful factors

Solution Approach 1:

The patent applies preliminary electrostatic charging to the substrate surface before introducing ozone gas for oxidation. This preliminary action creates a protective electrostatic field that repels metal ions during the subsequent ozone treatment, allowing effective organic film removal without metal contamination

Inventive Principle:
Principle #10Preliminary action

Solution Approach 2:

The electrostatic charger acts as an intermediary protective layer between the ozone gas treatment and the substrate surface, enabling the oxidation process to proceed effectively while blocking metal ions from adhering to the substrate

Inventive Principle:
Principle #24Intermediary (Mediator)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

Reduces the likelihood of metal contamination by repelling metal ions from the substrate surface, ensuring effective oxidation and removal of organic matter without contaminating the substrate.

Implementation Method 1

an electrostatic charging unit including an electrostatic charger for positively charging a first main surface of a substrate

Methodology Applied
Scientific EffectElectrostatic charging: Electrostatic Induction

Implementation Method 2

the process involving the generation of metal ions in the processing chamber

Methodology Applied
Scientific EffectIon repulsion: Ion Repulsion/Attraction

Implementation Method 3

performing a process including at least one of the heating of the substrate in the processing chamber

Methodology Applied
Scientific EffectThermal heating: Heating

Implementation Method 4

Ozone gas is supplied through the ozone gas supply line into the heat treatment chamber, and acts on a main surface of the substrate. The ozone gas is able to oxidize and decompose an organic film on the main surface of the substrate

Methodology Applied
Scientific EffectOxidation: Oxidation

Data Source

PatentUS20260066221A1Substrate processing apparatus and substrate processing method
Publication Date: 2026.03.05 SCREEN HOLDINGS CO LTD
  • US20260066221A1 patent drawing
  • US20260066221A1 patent drawing
  • US20260066221A1 patent drawing

AI summary

A substrate processing apparatus includes an electrostatic charging unit and a processing unit. The electrostatic charging unit includes an electrostatic charger positively charging a first main surface of a substrate. The processing unit includes a processing chamber, and performs a process which includes at least one of heating of the substrate in the processing chamber and supply of a processing gas to the substrate and which involves the generation of metal ions in the processing chamber.