Substrate Chemical Replenishment Using Evaporation Feedback
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Solution Overview
Problem
Existing substrate processing systems fail to maintain uniform chemical liquid concentration due to insufficient water replenishment, leading to non-uniform etching rates and continuous dilution of the chemical liquid during idle standby periods.
Innovation Solution
A substrate processing apparatus and method that includes an evaporation measurement member, such as a level sensor, to measure water evaporation in chemical storage units, and a control unit to automatically adjust water supply based on evaporation rates and etching reaction dynamics, ensuring precise water replenishment to maintain chemical liquid concentration.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If water is supplied to the chemical liquid based on a certain period of time, then the system operation is simple, but the concentration of the chemical liquid cannot be uniformly managed due to evaporation variations
Solution Approach 1:
The system measures the actual water level in the tank and uses this feedback to calculate evaporation amount, then adjusts water supply accordingly. This closed-loop feedback mechanism ensures that water supply matches actual evaporation losses, maintaining uniform chemical liquid concentration while operating automatically.
Solution Approach 2:
The patent replaces manual time-based water supply with an automated system using level sensors and control units that calculate and execute water supply based on measured evaporation. This substitution of mechanical/manual operation with automated measurement and control resolves the contradiction between operational simplicity and concentration precision.
2Manufacturing precision
If water is continuously supplied to the chemical liquid, then the concentration dilution is prevented, but the etching rate becomes unstable and may gradually rise
Solution Approach 1:
By continuously monitoring water level and calculating evaporation in real-time, the system provides feedback-based water supply that matches actual needs. This prevents both over-supply (which would dilute the chemical liquid and affect etching rate) and under-supply (which would allow concentration variations), thereby maintaining both concentration stability and etching rate uniformity.
Solution Approach 2:
The system dynamically adjusts water supply based on current evaporation rates rather than using fixed time-based intervals. This dynamic adaptation allows the water supply rate to vary according to actual conditions, preventing concentration dilution while maintaining stable etching rates.
3Device complexity
If water supply is based on predetermined time intervals, then the system complexity is low, but the evaporation loss compensation is insufficient
Solution Approach 1:
The system uses level sensor feedback to measure actual water level changes and calculate evaporation amounts. This measured data feeds into the control unit which determines the precise water supply needed, ensuring adequate compensation for evaporation losses without requiring complex manual intervention.
Solution Approach 2:
The system performs self-measurement of evaporation through level sensors and self-calculation of required water supply through the control unit. This automated self-service approach compensates for evaporation losses accurately while keeping the overall system relatively simple, avoiding the need for complex external monitoring and manual adjustment mechanisms.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively maintains uniform chemical liquid concentration, stabilizing etching rates and preventing dilution, thereby optimizing substrate processing efficiency and reducing waste.
Implementation Method 1
an evaporation measurement member for measuring the amount of evaporation of water contained in the chemical liquid
Data Source
AI summary
A substrate processing apparatus includes a substrate processing unit for processing a substrate by discharging a chemical liquid to the substrate; a chemical storage unit connected to the substrate processing unit by a chemical liquid supply line and a chemical liquid recovery line; and a liquid replenishment unit including an evaporation measurement member for measuring the amount of evaporation of water contained in the chemical liquid, and a water supply member for supplying water to the chemical liquid.


