Substrate Chuck Structure With Adiabatic Space for Thermal Deformation Control
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Solution Overview
Problem
Existing substrate supporting devices face challenges in preventing thermal damage, quickly controlling substrate temperature, and managing thermal expansion-induced deformation during high-temperature processing, while also struggling to independently control edge and center region temperatures effectively.
Innovation Solution
The proposed solution involves a substrate supporting device comprising a cooling plate, a thermal-insulation plate with an adiabatic space, and a chucking plate with a heater, where the chucking plate is vertically separated from the cooling plate by a sealed adiabatic space, allowing for independent temperature control of the substrate's edge and center regions through vacuum pressure and heat transfer fluid management.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a substrate is heated to high temperature for processing, then processing capability is improved, but thermal damage to components and thermal deformation occur
Solution Approach 1:
The substrate supporting device is divided into separate functional zones: a heating zone with heater elements for temperature control and a cooling zone with cooling plates for heat dissipation. This segmentation allows independent control of thermal conditions in different regions, enabling high-temperature processing while preventing thermal damage to components through localized cooling.
Solution Approach 2:
A thermal insulation layer is introduced as an intermediary between the heating elements and the substrate, and between the substrate and the cooling plate. This intermediary controls heat transfer, allowing efficient heating when needed while preventing excessive heat accumulation that would cause thermal damage and deformation.
2Productivity
If uniform heating is applied to the substrate, then heating efficiency is improved, but independent temperature control of edge and center regions is lost
Solution Approach 1:
The heating system employs multiple independently controllable heater elements positioned at different locations (center and edge regions) of the substrate. Each heater can be controlled separately to provide different temperature conditions in different regions, enabling independent temperature control while maintaining overall heating efficiency through coordinated operation of multiple elements.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enables efficient high-temperature substrate processing, prevents thermal damage to components, allows for rapid temperature control, suppresses thermal deformation, and enables independent temperature control of substrate regions, enhancing processing precision and consistency.
Implementation Method 1
The chucking plate may include a heater
Implementation Method 2
The chucking plate may be vertically separated from the cooling plate by an adiabatic space, which is sealed and under the chucking plate
Implementation Method 3
a cooling plate with a cooling hole
Data Source
AI summary
A substrate supporting device may include a cooling plate including a cooling hole, a thermal-insulation plate on the cooling plate, and a chucking plate placed on the thermal-insulation plate. The chucking plate may include a heater. The thermal-insulation plate may include an adiabatic space, which is recessed from a top surface of the thermal-insulation plate by a depth in a downward direction. The cooling plate may include a connection hole, which vertically extends and is connected to the adiabatic space.