Substrate Chuck Centering With Multi-Point Eccentricity Correction
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Solution Overview
Problem
In semiconductor manufacturing, substrates must be accurately positioned to ensure uniform treatment, particularly in liquid and plasma processes, as incorrect positioning leads to non-uniform coating and etching, resulting in decreased yield due to misalignment and changes in plasma sheath formation.
Innovation Solution
A substrate treating apparatus with an eccentricity correction unit that contacts multiple points on the substrate to align its center with the chuck's center, using first and second correction parts to adjust the substrate's position, and a displacement measurement part to ensure precise alignment within an error range, facilitating uniform treatment of the edge region.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If the substrate is mounted on the chuck without eccentricity correction, then the mounting process is simple and quick, but the substrate center does not align with the chuck center, causing non-uniform treatment
Solution Approach 1:
The system measures the actual position of the substrate center relative to the chuck center (eccentricity parameters) and adjusts the substrate position by controlled displacement amounts based on these measured parameters, transforming the positioning from a fixed state to an adjustable state that achieves precise alignment
Solution Approach 2:
The patent replaces complex mechanical pre-alignment mechanisms with a measurement-and-correction system that uses sensors to detect substrate position and actuators to make precise adjustments, substituting mechanical complexity with a controlled measurement-correction process
2Measurement precision
If multiple correction parts contact multiple points on the substrate, then the positioning accuracy is improved, but the device structure becomes more complex
Solution Approach 1:
The correction unit is divided into multiple independent correction parts, each responsible for contacting and adjusting a specific point on the substrate. This segmentation allows each part to be simpler in structure while collectively achieving high positioning accuracy through coordinated action of multiple parts
Solution Approach 2:
Multiple correction parts are integrated into a single correction unit that works together to achieve substrate alignment. The combined action of several simple contact points creates the equivalent of a complex positioning system while maintaining individual component simplicity
Data Source
AI summary
The inventive concept provides a substrate treating apparatus. The substrate treating apparatus includes a chuck supporting a substrate; a liquid supply unit configured to supply a liquid to a substrate supported on the chuck; a treating container surrounding the substrate supported on the chuck; and an eccentricity correction unit configured to correct an eccentricity of the substrate supported on the chuck, and wherein the eccentricity correction unit contacts a plurality of points on a side end of the substrate supported on the chuck to match a center of the substrate with a center of the chuck.