Substrate Chuck Deformation for Uniform Deposition Mask Gaps
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Solution Overview
Problem
The warpage and sagging of deposition masks during the manufacturing process of high-resolution display panels, due to residual stress and thermal expansion differences, lead to gaps and reduced parallelism between the substrate and the deposition mask, affecting the manufacturing precision of wearable devices like AR glasses.
Innovation Solution
A deposition apparatus with a substrate chuck that applies pressure to its central portion, convexly deforming it towards the deposition mask, using a hexapod actuator for motion control, and electrostatic chucks for precise alignment, along with gap sensors and cameras for real-time adjustments to maintain uniform gaps and parallelism.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If a deposition mask is used for high-resolution display panel manufacturing, then manufacturing precision is improved, but warpage and sagging occur due to residual stress and thermal expansion differences
Solution Approach 1:
The substrate chuck applies dynamic pressure to the central portion of the substrate, changing the physical state from flat to convexly deformed. This parameter change in the substrate's shape compensates for the warpage and sagging of the deposition mask, maintaining consistent gap distance and parallelism during the deposition process
Solution Approach 2:
The substrate chuck acts as an intermediary between the substrate and the deposition mask. By applying pressure through the chuck, the substrate is convexly deformed to compensate for mask warpage, and the chuck serves as a mediator to maintain the required gap consistency without direct contact between the mask and substrate
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution ensures consistent gaps and improved parallelism between the substrate and deposition mask, enhancing the manufacturing precision of high-resolution display panels for wearable devices.
Implementation Method 1
The chuck pressurizing portion may be configured to apply the pressure the central portion of the substrate chuck such that the substrate chuck is deformed within an elastic limit
Implementation Method 2
a first electrostatic electrode configured to provide a first electrostatic force associated with holding a central portion of the substrate, and a second electrostatic electrode configured to provide a second electrostatic force associated with holding an edge portion of the substrate
Data Source
AI summary
Provided are a deposition apparatus, a method of manufacturing a display panel using the deposition apparatus, and an electronic device manufactured by using the deposition apparatus. The deposition apparatus includes a deposition source configured to provide a deposition material onto a substrate, a substrate chuck configured to support the substrate such that the substrate faces the deposition source, a mask chuck disposed between the deposition source and the substrate chuck and configured to support a deposition mask such that the deposition mask faces the substrate, a substrate chuck driver configured to move the substrate chuck such that the substrate is positioned on the deposition mask, and a chuck pressurizing portion configured to apply pressure to a central portion of the substrate chuck such that the substrate chuck is convexly deformed toward the deposition mask.