Substrate Chuck Pin Assembly With Compact Peripheral Mechanism Layout
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Solution Overview
Problem
Conventional substrate support assemblies for semiconductor fabrication are complex in structure, occupy excessive volume, and require lengthy and cumbersome maintenance processes, particularly when exchanging chuck pins.
Innovation Solution
A substrate support assembly with a chuck base having an installation accommodation portion for intensively disposing the mechanism unit around the outer peripheral surface, allowing for compact construction of various parts and facilitating rapid and easy maintenance of chuck pins.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If a conventional substrate support assembly uses a mechanism unit connected to chuck pins, then the assembly can move chuck pins between holding and releasing positions, but the structure becomes complicated and the overall volume becomes bulky
Solution Approach 1:
The mechanism unit is divided into multiple independent mechanism modules, each responsible for moving a specific chuck pin. This segmentation allows each module to be simplified and optimized independently, reducing overall structural complexity while maintaining full functionality for chuck pin movement.
Solution Approach 2:
The mechanism modules are disposed in an intensive arrangement where they are nested or closely integrated around the outer peripheral surface of the chuck base. This nesting approach maximizes space utilization, reducing the overall volume of the assembly while keeping all necessary components accessible and functional.
2Volume of stationary object
If the mechanism unit is disposed in an intensive arrangement around the outer peripheral surface of the chuck base, then the overall volume is reduced, but the inner space for accommodating other parts becomes limited
Solution Approach 1:
The mechanism modules are arranged in a three-dimensional intensive configuration around the outer peripheral surface of the chuck base, utilizing vertical and radial spaces efficiently. This dimensional arrangement reduces the horizontal footprint and overall volume while creating adequate inner space within the chuck base structure for accommodating other necessary parts.
Solution Approach 2:
The intensive arrangement of mechanism modules is specifically localized around the outer peripheral surface of the chuck base, concentrating the mechanical functionality in this region. This localized arrangement preserves the central inner space of the chuck base for accommodating other parts, achieving both volume reduction and sufficient internal space.
3Ease of repair
If the top of the spin head is removed to exchange chuck pins, then complete access to chuck pins is achieved, but the maintenance process requires many hours and works
Solution Approach 1:
The mechanism modules are pre-configured with quick-release interfaces and standardized connections that allow chuck pins to be exchanged without removing the spin head. This preliminary design of accessible connection structures enables maintenance personnel to quickly access and replace chuck pins, dramatically reducing maintenance time and effort.
4Volume of moving object
If multiple mechanism modules are disposed in an intensive arrangement, then the assembly becomes more compact, but the precision of chuck pin positioning may be compromised
Solution Approach 1:
By dividing the mechanism into separate modules, each module can be independently precision-engineered and calibrated for accurate chuck pin positioning. The segmentation allows for specialized precision components in each module while maintaining overall compactness through their intensive arrangement.
Data Source
AI summary
The present invention relates to a substrate support assembly for a substrate treatment apparatus, including: a chuck base disposed opposite to a substrate when the substrate is installed, rotatable around a rotating shaft, and having an installation accommodation portion formed in the lower portion near the outer peripheral surface thereof in a circumferential direction thereof; chuck pins disposed on top of the chuck base and movable along directions away from and approaching the substrate; a mechanism unit disposed in the installation accommodation portion and connected to the chuck pins to move the chuck pins; and a driving unit for transmitting power to the mechanism unit.