Substrate Chuck Separation Control Under Residual Attraction Force
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Solution Overview
Problem
In semiconductor and display device manufacturing, stage apparatuses face challenges in separating substrates from substrate chucks due to residual attraction forces, leading to substrate abrasion and reduced productivity.
Innovation Solution
A stage apparatus with a substrate chuck and pins, where a control portion manages the driving portion to adjust the separation based on conditions related to the ease of separation, including speed, acceleration, and movement, to minimize the impact of residual attraction forces.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If the driven member is moved at a high speed to separate the substrate from the substrate chuck, then the productivity is improved, but the residual attraction force causes horizontal displacement and abrasion of the substrate chuck
Solution Approach 1:
The control portion preliminarily determines the easiness of separation between the substrate and substrate chuck before initiating the separation process. Based on this preliminary determination, the control portion selects appropriate separation conditions (speed, acceleration, movement distance) to prevent substrate chuck abrasion while maintaining productivity. This preliminary assessment allows the system to prepare optimal separation parameters in advance, avoiding harmful effects during the actual separation operation.
Solution Approach 2:
The separation conditions are made dynamic rather than fixed. The control portion adjusts separation speed, acceleration, and movement distance based on the determined easiness of separation. When separation is difficult, the system uses lower speed and higher acceleration with larger movement distance; when separation is easy, it uses higher speed with lower acceleration. This dynamic adaptation resolves the contradiction by optimizing parameters in real-time based on actual substrate-chuck interaction characteristics.
2Object-affected harmful factors
If the driven member is moved at a low speed to reduce substrate chuck abrasion, then the substrate chuck abrasion is reduced, but the productivity deteriorates
Solution Approach 1:
The system changes multiple separation parameters simultaneously (speed, acceleration, movement distance) based on the determined easiness of separation. Instead of simply reducing speed to prevent abrasion, the control portion optimizes the combination of parameters: using lower speed with higher acceleration and larger movement distance when separation is difficult, while maintaining higher speed when separation is easy. This multi-parameter optimization resolves the productivity-loss contradiction by achieving safe separation without unnecessary speed reduction.
3Object-affected harmful factors
If the separation conditions are optimized for each case to reduce residual attraction force effects, then the substrate chuck abrasion is reduced, but the device complexity increases
Solution Approach 1:
The control portion autonomously determines the easiness of separation and selects appropriate separation conditions without requiring external intervention or complex external control systems. The system uses its own measurement and control capabilities to assess substrate-chuck interaction and automatically adjust separation parameters. This self-service approach reduces the need for additional complex external equipment while achieving optimized separation for each case, thereby limiting the increase in device complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach reduces substrate chuck abrasion and enhances productivity by optimizing the separation process based on specific conditions related to the attraction force and substrate characteristics.
Implementation Method 1
a substrate chuck (3) configured to attract and hold the substrate (2)
Implementation Method 2
a pin (6) configured to be able to attract and hold the substrate (2)
Data Source
AI summary
A stage apparatus includes a substrate chuck configured to attract and hold a substrate, a pin configured to be able to attract and hold the substrate, the pin being configured to be able to protrude from the substrate chuck through a hole in the substrate chuck, a driving portion configured to move one of the substrate chuck and the pin relative to the other of the substrate chuck and the pin, and a control portion configured to control the driving portion, wherein in a case where the substrate and the substrate chuck separate from each other, the control portion controls the driving portion based on a first condition related to easiness of separation between the substrate and the substrate chuck.