Substrate Chuck Grounding Path for Static Charge Removal

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Solution Overview

Problem

The accumulation of static electricity in the chuck of a substrate processing apparatus due to cooling fluid friction leads to arcing and reduces RF discharge efficiency, complicating the generation of RF discharge.

Innovation Solution

A substrate processing apparatus with a support unit that includes a chuck, an ionization path through a ground member with high impedance, and temperature control using insulated and conductive fluid lines to manage static electricity, ensuring efficient RF discharge.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If a ground line is connected to the chuck to remove static electricity, then static electricity accumulation is reduced, but RF discharge becomes difficult to generate

Engineering Contradiction:
Improvestatic electricity removalVSAvoidRF discharge efficiency
Core Design Contradiction:
ReliabilityVSPower

Solution Approach 1:

The grounding path is segmented into two separate paths: one for RF power (through the chuck to the RF coil) and one for static electricity removal (through the support unit to the chamber wall). This segmentation allows both functions to operate independently without interfering with each other, resolving the contradiction between static electricity removal and RF discharge efficiency

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The support unit acts as an intermediary component that provides a dedicated path for static electricity removal while maintaining the RF isolation of the chuck. By introducing this intermediate grounding structure, the system can remove static electricity without creating a direct ground connection that would interfere with RF discharge

Inventive Principle:
Principle #24Intermediary (Mediator)

2Temperature

If the chuck is cooled by supplying cooling fluid through flow paths, then temperature control is achieved, but static electricity is generated by friction

Engineering Contradiction:
Improvechuck temperature controlVSAvoidstatic electricity generation
Core Design Contradiction:
TemperatureVSObject-generated harmful factors

Solution Approach 1:

The harmful effect of static electricity generation is extracted and isolated from the main chuck structure by providing a separate grounding path through the support unit. This allows the cooling function to continue while the unwanted static electricity is removed through the dedicated path, preventing arcing and interference with RF discharge

Inventive Principle:
Principle #2Taking out (Extraction)

Solution Approach 2:

The support unit serves as an intermediary that handles the static electricity generated during cooling, providing a separate discharge path that does not interfere with the RF field or the primary cooling function of the chuck

Inventive Principle:
Principle #24Intermediary (Mediator)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The apparatus effectively removes static electricity from the chuck, maintaining RF discharge efficiency and enabling efficient substrate processing.

Implementation Method 1

an ionization path through which static electricity generated in the chuck is removed

Methodology Applied
Scientific EffectElectrical conduction: Conduction (electrical)

Implementation Method 2

The RF power source generates plasma by forming RF electromagnetic fields in a space in a chamber

Methodology Applied
Scientific EffectRF electromagnetic field generation: Electromagnetic Induction

Implementation Method 3

Plasma refers to an ionized gas state consisting of ions, radicals, electrons, and the like

Methodology Applied
Scientific EffectPlasma ionization: Plasma

Implementation Method 4

The ashing or etching process is performed as ions and radical particles included in plasma collide with or react the film material on the substrate

Methodology Applied
Scientific EffectChemical reaction: Chemical Bonding

Implementation Method 5

a chiller for supplying a cooling fluid through a flow path formed in the chuck

Methodology Applied
Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 6

supplying the cooling fluid through the flow path formed in the chuck and collecting the cooling fluid from the flow path

Methodology Applied
Scientific EffectConvection: Convection

Implementation Method 7

static electricity is generated by friction between the cooling fluid and the chuck or friction between the cooling fluid and a pipe

Methodology Applied
Scientific EffectTriboelectric effect: Triboelectric Effect

Data Source

PatentUS12531216B2Support unit and substrate processing apparatus including same
Publication Date: 2026.01.20 PSK INC
  • US12531216B2 patent drawing
  • US12531216B2 patent drawing
  • US12531216B2 patent drawing

AI summary

The present disclosure provides a substrate processing apparatus. The substrate processing apparatus includes a chamber defining a processing space, a gas supply unit supplying a process gas to the processing space, and a support unit supporting a substrate in the processing space, wherein the support unit includes a chuck supporting the substrate, a power applying RF power to the chuck, and an ionization path through which static electricity generated in the chuck is removed.