Substrate Chuck Thermal Zoning for Uniform Wafer Temperature
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Solution Overview
Problem
Existing substrate processing apparatuses face challenges in achieving uniform temperature distribution across substrates due to complex heater structures and difficulty in precise temperature control, whether the substrate chuck is divided into a small or large number of regions.
Innovation Solution
A substrate processing apparatus with a heat absorbing plate and heat shielding plate, divided into multiple heating areas, and a nozzle block for spraying cooling gas, allowing selective adjustment of temperature through heat absorption, shielding, and gas control.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If the substrate chuck is divided into a relatively small number of regions and heated for each region, then the heater structure is simple, but the temperature distribution of the substrate chuck becomes non-uniform
Solution Approach 1:
The substrate chuck is divided into multiple heating regions (first, second, third, and fourth heating regions) with different heater configurations. Each region has independently controllable heaters that can be adjusted according to specific temperature requirements, allowing uniform temperature distribution across the entire substrate chuck while maintaining reasonable structural complexity in each segment.
2Temperature
If the substrate chuck is divided into a relatively large number of regions and heated each region, then the temperature distribution of the substrate chuck becomes uniform, but the heater structure becomes complicated and installation becomes difficult
Solution Approach 1:
Adjacent heating regions with similar temperature requirements are merged into larger zones (e.g., first and second heating regions, third and fourth heating regions). This reduces the total number of independently controlled regions while still achieving uniform temperature distribution across the substrate chuck, simplifying the heater structure and installation process.
Solution Approach 2:
The heater system is designed with multi-functional capabilities where certain heaters can serve multiple heating regions. The control unit can selectively activate different heater combinations based on the required temperature profile, allowing a single heater structure to achieve multiple temperature distribution patterns without requiring separate heater systems for each region.
3Temperature
If the substrate chuck is divided into a relatively large number of regions and heated each region, then the temperature distribution of the substrate chuck becomes uniform, but the manufacturing of the substrate chuck becomes disadvantageous
Solution Approach 1:
The substrate chuck is segmented into four distinct heating regions with standardized heater modules in each region. This segmentation allows for modular manufacturing where each region can be independently fabricated and then assembled into the complete substrate chuck, simplifying the overall manufacturing process while achieving uniform temperature distribution.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The apparatus achieves uniform temperature distribution across substrates by minimizing temperature deviations and enabling precise temperature control with a simpler configuration.
Implementation Method 1
a heat absorbing plate provided on a lower surface of the substrate chuck and configured to adjust temperature of the substrate chuck by absorbing heat from the substrate chuck
Implementation Method 2
a nozzle block configured to spray a cooling gas upward from below the heat shielding plate
Data Source
AI summary
Proposed is a substrate processing apparatus including a process chamber configured to provide a substrate processing space, a substrate chuck configured to support a substrate in the substrate processing space, have a heater, and control temperature of the substrate, and a chuck temperature control unit configured to divide the substrate chuck into a plurality of heating areas and regulate temperature of the substrate chuck by heating area through heat absorption, heat shielding, and cooling.