Substrate Chuck Flow Passage Layout for Warped Wafer Holding
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional bonding apparatuses struggle to stably hold warped substrates due to insufficient attracting force in the peripheral regions, leading to instability during the bonding process.
Innovation Solution
The bonding system incorporates an upper chuck with a circular attraction surface featuring a flow passage between ribs that form an air flow towards a central suction hole, enhancing the attracting force and stability of warped substrates by increasing air flow velocity in the peripheral regions.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional suction holding is used on warped substrates, then the central region can be held, but the peripheral region lacks sufficient attracting force causing instability
Solution Approach 1:
The suction surface is segmented into multiple radial flow passages separated by ribs, allowing independent control of air flow in different regions. This segmentation enables enhanced suction force specifically in the peripheral region through dedicated flow passages, resolving the contradiction between central and peripheral holding stability.
Solution Approach 2:
Different regions of the suction surface are given different properties through the rib structure. The peripheral flow passages are designed with specific characteristics (such as shorter length or different cross-section) to provide stronger attracting force in the peripheral region, while the central region maintains its holding function, achieving local optimization for warped substrates.
2Reliability
If regional suction control is implemented to improve peripheral holding, then substrate stability improves, but device complexity increases
Solution Approach 1:
Multiple flow passages are merged into a single suction hole located at the center. The ribs divide the surface into flow passages, but all passages converge to the same suction hole, eliminating the need for multiple independent suction sources or complex regional control systems while still achieving differential flow control.
Solution Approach 2:
The rib structure automatically creates the flow passage geometry needed for peripheral region enhancement. The physical presence of ribs extending from the center to the periphery self-regulates the air flow distribution, with the flow passages naturally providing the required characteristics without additional active control mechanisms.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration ensures stable holding of warped substrates by increasing the attracting force, reducing manufacturing and operating costs, and facilitating efficient bonding without the need for complex regional suction control.
Implementation Method 1
a suction hole 250 is located in the flow passage 242 on the central region side 241a of the attraction surface 241
Data Source
AI summary
A substrate holding device includes a main body, a flow passage and a suction hole. The main body has a circular attraction surface facing a circular plate-shaped substrate. The flow passage is formed between a pair of ribs extending from a central region of the attraction surface to a peripheral region of the attraction surface. The suction hole is located in the flow passage on a central region side of the attraction surface. Air flow is formed along the flow passage, heading from the peripheral region toward the suction hole as the pair of ribs come close to or into contact with the substrate.