Substrate Circuit Layout for Encapsulation Air Exhaust in Electronic Packages
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Solution Overview
Problem
Conventional semiconductor packages face issues with voids or overflows in the encapsulant due to poor air exhaust, leading to problems like popcorn or delamination, which result in poor production yield.
Innovation Solution
The substrate structure features a functional circuit with a first block on the encapsulation area, a second block on the peripheral area, and a wire connecting them, where the wire has a width less than the first block, creating an exhaust passage when the encapsulation layer is formed.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a sheet-shaped grounding circuit is used to provide grounding function, then grounding reliability is improved, but air exhaust performance deteriorates due to large area occupying the boundary line
Solution Approach 1:
The grounding circuit is segmented from a continuous sheet shape into a discontinuous structure with multiple separate grounding pads connected by narrow wires. This segmentation reduces the overall area occupied at the boundary line while maintaining grounding functionality through multiple connection points, thereby improving air exhaust performance during encapsulation.
Solution Approach 2:
The grounding circuit uses narrow wires (100-150 micrometers wide) instead of a broad sheet structure at the critical boundary line area. This local modification reduces the area occupation at the encapsulation-peripheral boundary while maintaining grounding effectiveness through strategic placement of grounding pads, resolving the conflict between grounding reliability and air exhaust performance.
2Reliability
If a large-area sheet-shaped grounding circuit is used, then grounding coverage is improved, but manufacturing precision deteriorates due to voids or overflows in encapsulant
Solution Approach 1:
The continuous sheet-shaped grounding circuit is divided into discrete grounding pads connected by narrow wires. This segmentation creates gaps between grounding elements that facilitate air exhaust during encapsulation, preventing voids and overflows while maintaining adequate grounding coverage through multiple distributed pads.
Solution Approach 2:
The grounding circuit structure creates a porous or discontinuous pattern at the boundary line area, allowing air and encapsulant material to flow through gaps between grounding elements. This improves manufacturing precision by preventing encapsulant defects while maintaining grounding functionality.
3Reliability
If a sheet-shaped grounding circuit is used, then electrical connectivity is improved, but production yield deteriorates due to popcorn or delamination
Solution Approach 1:
The grounding circuit is segmented into multiple separate pads connected by narrow wires, reducing area occupation at the boundary line. This prevents encapsulant voids and overflows that cause popcorn and delamination, thereby improving production yield while maintaining electrical connectivity through the segmented structure.
Solution Approach 2:
The grounding circuit applies local quality modification by using narrow wires (100-150 micrometers) instead of a broad sheet structure at the critical boundary line area. This local change prevents encapsulation defects that lead to popcorn and delamination, improving production yield while maintaining grounding connectivity.
Data Source
AI summary
An electronic package is provided and includes a substrate structure, an electronic element disposed on the substrate structure and an encapsulation layer encapsulating the electronic element, where at least one functional circuit is formed on a surface of a substrate body of the substrate structure, and a wire having a smaller width is arranged on a boundary line at a junction between an encapsulation area and a peripheral area, so that when a mold for forming the encapsulation layer is formed to cover the substrate structure, the mold will create a gap around the wire to serve as an exhaust passage. Therefore, when the encapsulation layer is formed, the exhaust passage can be used to exhaust air, so as to avoid problems such as the occurrence of voids or overflows of the encapsulation layer.