Substrate Circuit Layout for Verifying Opposite-Side Electrical Connections
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Solution Overview
Problem
Existing electronic devices face challenges in verifying the electrical connections between circuits, which affects their reliability and performance.
Innovation Solution
A method is introduced to verify the electrical connections between circuits by applying testing signals to first and second circuits formed on opposite surfaces of a substrate, using signal probes and optical inspections to identify open or short circuits, and forming connecting patterns to ensure proper electrical connectivity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If traditional manufacturing methods are used without verification, then production speed is maintained, but reliability of electrical connections deteriorates
Solution Approach 1:
The patent applies preliminary action by performing electrical connection verification during the manufacturing process itself, rather than after completion. The testing signal is applied through test holes formed in the substrate to verify connections between conductive patterns before final assembly, preventing defective products from proceeding to later stages.
Solution Approach 2:
The patent uses an intermediary approach by introducing a testing signal as a mediator to verify electrical connections. The test signal traverses through the conductive patterns and substrates to detect connection status, serving as an intermediate verification step that does not interfere with the final product functionality.
2Reliability
If comprehensive verification methods are implemented, then reliability improves, but device complexity increases
Solution Approach 1:
The patent segments the verification process into discrete test holes positioned at specific locations on the substrate. Each test hole corresponds to a specific electrical connection point, allowing individual verification of different connection paths without requiring a complex integrated testing system.
Solution Approach 2:
The patent implements self-service verification where the device under manufacturing performs its own electrical connection testing. The conductive patterns and substrates themselves serve as the testing pathway, eliminating the need for external complex verification equipment.
3Measurement precision
If test holes are formed to verify connections, then measurement precision improves, but manufacturing complexity increases
Solution Approach 1:
The patent merges the test hole formation process with the existing manufacturing process. The test holes are formed using the same drilling or etching equipment already used for creating through-holes in the substrate, combining verification functionality with existing manufacturing capabilities rather than requiring separate specialized equipment.
Solution Approach 2:
The test holes serve multiple functions: they provide mechanical support structures, enable electrical connection verification, and can serve as pathways for subsequent wiring or signal transmission. This multi-functionality reduces the need for additional specialized features that would increase manufacturing complexity.
Data Source
AI summary
An electronic device includes a substrate, electronic elements, a layer, first bonding pads, a transistor and second bonding pads. The electronic elements are disposed on the substrate. The layer is disposed between the substrate and the electronic elements. The first bonding pads are disposed on a first side of the substrate. The transistor is electrically connected with at least one of the electronic elements. The second bonding pads are disposed on a second side of the substrate and separated from the first bonding pads. The first side is opposite to the second side, and a number of the first bonding pads is different from a number of the second bonding pads. At least one of the first bonding pads is overlapped with the at least one of the electronic elements, and another one of the first bonding pads is overlapped with the transistor.