Substrate Clamping Fixture for Thin Wafer Transfer
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Solution Overview
Problem
The clamping issues during substrate transfer and cleaning processes, particularly with thin substrates, lead to warpage and damage, hindering smooth insertion into accommodating frames and subsequent processes.
Innovation Solution
A substrate processing apparatus with a first frame and power mechanisms, including fixtures, racks, gears, and elastic elements, facilitates secure clamping and release of substrates, enabling efficient transfer to subsequent processes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If substrates are manually inserted one by one into accommodating frames, then the process is simple to operate, but thin substrates cause warpage and cannot be smoothly inserted, leading to damage
Solution Approach 1:
The patent introduces a clamping mechanism with clamping arms as an intermediary device between the manual operation and the substrate. This mediator provides controlled support and positioning, enabling smooth insertion without direct manual handling that causes warpage and damage to thin substrates.
Solution Approach 2:
The patent replaces the manual mechanical insertion process with an automated clamping and insertion system. The clamping mechanism with powered actuation substitutes human hands and fingers, providing precise control forces that prevent substrate deformation while maintaining ease of operation.
2Reliability
If traditional clamping methods are used, then the substrate can be held during processing, but thin substrates experience warpage and damage due to insufficient support
Solution Approach 1:
The clamping mechanism is divided into multiple clamping arms that can independently contact different regions of the substrate. This segmentation allows distributed support across the substrate surface, preventing localized stress concentrations that cause warpage while maintaining overall holding capability.
Solution Approach 2:
The clamping arms are designed with cushioning elements or compliant features that provide gentle, distributed contact with the substrate before insertion. This beforehand cushioning prevents sudden stress applications that could cause warpage or damage to thin substrates during the clamping process.
3Productivity
If multiple substrates are processed sequentially, then the accommodating frame can be efficiently utilized, but the transfer process becomes time-consuming and increases the risk of substrate damage
Solution Approach 1:
The patent merges the clamping and insertion operations into a single integrated mechanism action. The clamping arms simultaneously clamp multiple substrates and facilitate their collective insertion into the accommodating frame, reducing the number of separate operations and minimizing transfer time while maintaining efficient frame utilization.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The apparatus effectively clamps and releases substrates, reducing damage and ensuring smooth transfer, even with thin substrates, by using fixtures with lower and upper clamping parts and power mechanisms to manage substrate movement.
Implementation Method 1
an elastic element (24) is provided between the rack (22) and the housing (21), wherein the elastic element (24) is in a compressed state
Data Source
AI summary
A substrate processing apparatus includes a substrate cleaning apparatus. Accordingly, the present application can be used for the transfer of the substrate cleaning and insertion frame, in order to achieve the effect of facilitating the transfer of the substrate to subsequent processes.