Rotating Substrate Clamping for Uniform Liquid Processing

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Solution Overview

Problem

Existing substrate processing methods face challenges in achieving uniform processing and preventing substrate deviation during rotation, leading to uneven processing and potential wear, which results in particle generation and processing inefficiencies.

Innovation Solution

A substrate processing apparatus with a holder and rotator system that includes multiple clampers to alternately clamp the substrate's peripheral edge, utilizing centrifugal force and spring mechanisms to maintain secure clamping and control liquid distribution, allowing for balanced clamping and uniform processing without altering the substrate's rotational speed.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Device complexity

If a single clamper is used to hold the substrate during rotation, then the device complexity is reduced, but the substrate processing uniformity deteriorates due to uneven clamping and potential substrate deviation

Engineering Contradiction:

Improvenumber of clampersVSAvoidsubstrate processing uniformity

Core Design Contradiction:

Device complexityVSManufacturing precision

Solution Approach 1:

The clamping function is segmented into multiple independent clampers (at least two clampers) that are distributed around the substrate periphery. Each clamper independently clamps the substrate at different positions, ensuring uniform clamping force distribution and preventing substrate deviation during rotation, thereby maintaining processing uniformity without requiring a single complex clamping mechanism

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

Multiple clampers are combined to work simultaneously on the same substrate, with each clamper contributing to the overall clamping force. The clampers are coordinated to clamp and release the substrate in a synchronized manner, achieving both simplified individual clamper design and improved substrate processing uniformity through collective action

Inventive Principle:

Principle #5Merging (Combining)

2Productivity

If the substrate rotates relative to the spin base to achieve processing, then the processing speed is improved, but wear on the substrate and equipment increases leading to particle generation

Engineering Contradiction:

Improveprocessing speedVSAvoidwear and particle generation

Core Design Contradiction:

ProductivityVSObject-generated harmful factors

Solution Approach 1:

The substrate itself serves as the rotating element that contacts the processing liquid, eliminating the need for the substrate to rotate relative to the spin base. The clampers hold the substrate stationary relative to the spin base while the processing liquid is supplied to the substrate surface, reducing friction and wear between the substrate and mechanical components, thereby preventing particle generation while maintaining processing efficiency

Inventive Principle:

Principle #25Self-service

Solution Approach 2:

The mechanical relative rotation between substrate and spin base is replaced by a liquid-based processing system. The processing liquid is supplied to the substrate surface while the substrate remains stationary relative to the spin base, substituting mechanical friction with liquid-mediated processing, which reduces wear and particle generation while maintaining processing speed

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach ensures uniform substrate processing, reduces wear on both the substrate and processing equipment, and prevents particle generation by maintaining consistent clamping and rotation speeds, thereby enhancing processing efficiency and reducing unevenness.

Implementation Method 1

at least one first clamper configured to be rotated together with the turntable and moved between a clamping position at which the at least one first clamper clamps a peripheral edge of the substrate and a releasing position at which the at least one first clamper releases clamping the substrate

Methodology Applied

Scientific EffectElastic force: Elasticity

Implementation Method 2

Methodology Applied

Scientific EffectCentrifugal force: Centrifugal Force

Data Source

PatentUS20240178046A1Substrate processing method and substrate processing apparatus

Publication Date: 2024.05.30 TOKYO ELECTRON LTD

AI summary

A substrate processing apparatus includes a holder for holding a substrate horizontally, a rotator for rotating the holder, a liquid supplier for supplying liquid to the substrate, and a controller for controlling the holder, the rotator, and the liquid supplier. The holder includes a turntable configured to be rotated by the rotator, at least one first clamper configured to be rotated together with the turntable and moved between a clamping position and a releasing position, and at least one second clamper configured to be rotated with the turntable and moved between the clamping and releasing positions independently of the at least one first clamper. The controller controls the at least one first clamper and the at least one second clamper to alternately clamp the peripheral edge of the substrate while the holder is being rotated by the rotator and the liquid is being supplied to the substrate.