Single Substrate Cleaning Apparatus Backside Reversing
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Solution Overview
Problem
Current substrate cleaning processes for semiconductor manufacturing are inefficient and costly due to the need for separate equipment and complex steps to clean the backside of substrates, which can lead to contamination from particle generation during conveyance.
Innovation Solution
A single substrate cleaning apparatus and method that integrates a processing chamber, substrate supporting member, and a substrate reversing device with gripping and elevating units to efficiently clean the backside of substrates within the same chamber, reducing the need for separate reversing units and minimizing contamination.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If separate substrate reversing units and multiple cleaning chambers are used to clean the backside of substrates, then cleaning completeness is improved, but device complexity and cost increase
Solution Approach 1:
The patent combines the substrate reversing function and cleaning function into a single integrated chamber. The substrate reversing device is installed within the cleaning chamber, allowing the same chamber to perform both cleaning of the front surface and backside of substrates through in-chamber reversing operations, eliminating the need for separate reversing units and multiple chambers.
Solution Approach 2:
The cleaning chamber is designed to perform multiple functions: cleaning the front surface, housing the substrate reversing device, and enabling backside cleaning all within the same chamber. This multi-functional design reduces equipment complexity while maintaining comprehensive cleaning capability.
2Manufacturing precision
If substrates are conveyed between separate cleaning chambers and reversing units, then backside cleaning is achieved, but particle contamination increases
Solution Approach 1:
By merging the substrate reversing operation with the cleaning chamber, the patent eliminates the need to convey substrates between separate reversing units and cleaning chambers. All operations occur within the same controlled environment, preventing particle contamination during transfer.
3Manufacturing precision
If multiple separate cleaning apparatuses are used for front and backside cleaning, then cleaning effectiveness is improved, but maintenance cost increases
Solution Approach 1:
The patent merges front surface cleaning and backside cleaning capabilities into a single apparatus. The substrate reversing device is installed within the same cleaning chamber, allowing both surfaces to be cleaned in one integrated system, thereby reducing maintenance requirements and costs compared to separate cleaning apparatuses.
4Device complexity
If substrate reversing is performed outside the cleaning chamber, then equipment simplicity is maintained, but processing time increases
Solution Approach 1:
The patent combines the substrate reversing function with the cleaning chamber, allowing reversing operations to be performed during the cleaning process without requiring separate external reversing units. This integration eliminates additional conveyance steps and reduces total processing time while maintaining equipment simplicity through functional integration.
Data Source
AI summary
Provided are a single substrate cleaning apparatus, and a method for cleaning the backside of a substrate, where a substrate reversing device for cleaning the backside of a substrate is installed inside a processing chamber.