Substrate Cleaning Brush Dynamics for Lower Surface Contamination Control
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Solution Overview
Problem
Existing substrate cleaning apparatuses face challenges in ensuring the cleanliness of the lower surface central region of substrates, as contaminants can be transferred to the holding devices during cleaning, leading to cross-contamination and reduced cleanliness.
Innovation Solution
A substrate cleaning apparatus and method that involves a cleaning tool moving in a way to separate from and recontact the substrate's lower surface, ensuring the cleaning tool is in contact with the central region during part of the cleaning process without overlapping specific partial regions, thereby minimizing contaminant retention.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If the cleaning tool continuously contacts the lower surface of the substrate during cleaning, then cleaning coverage is improved, but contaminants are transferred to the holding device and cleanliness of the central region deteriorates
Solution Approach 1:
The cleaning tool is deliberately separated from the lower surface central region before and after cleaning operations to prevent contaminant transfer to the holding device. This preliminary anti-action ensures that the cleaning tool does not contact the central region when it is clean, thereby preventing contamination while still achieving effective cleaning of the central region during the cleaning process
Solution Approach 2:
The cleaning tool's contact state with the substrate is dynamically changed during the cleaning process. The tool alternates between contacting and separating from the lower surface, particularly separating before and after cleaning the central region while maintaining contact during cleaning. This dynamic contact control enables effective cleaning while preventing contaminant transfer to the holding device
2Object-generated harmful factors
If the cleaning tool is separated from the substrate to avoid contaminant transfer, then contaminant transfer is reduced, but cleaning effectiveness on the central region deteriorates
Solution Approach 1:
The cleaning tool implements periodic contact and separation actions during the cleaning process. The tool contacts the lower surface central region during cleaning operations and separates before and after these operations. This periodic action pattern ensures both effective cleaning during contact periods and contaminant transfer prevention during separation periods
Solution Approach 2:
The cleaning tool is positioned to contact the lower surface central region at specific timing during the cleaning process, ensuring that cleaning action is applied when needed while avoiding contact that would cause contaminant transfer. The preliminary positioning and timing control of contact and separation actions optimizes both cleaning effectiveness and contamination prevention
Data Source
AI summary
A substrate cleaning apparatus includes an upper holding device holding an outer peripheral end of a substrate, and a lower surface brush contacting a lower surface of the substrate to clean the lower surface. The lower surface brush moves from a state of being separated from the lower surface to contact a first partial region of the lower surface when cleaning of a lower surface central region of the substrate is started. Then, the lower surface brush moves into contact with the lower surface central region on the lower surface. The lower surface brush moves from a state of being in contact with the lower surface to be separated from a second partial region of the lower surface when cleaning of the lower surface central region is completed. At least one of the first partial region and the second partial region does not overlap the lower surface central region.