Substrate Cleaning Mixture Control for Stable Chemical Concentration
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Solution Overview
Problem
Current semiconductor manufacturing processes face challenges in maintaining the concentration of chemicals used for substrate cleaning, leading to potential degradation in processing performance due to chemical decay and metal impurity accumulation, which affects the yield and cost-effectiveness of the manufacturing process.
Innovation Solution
A system and method that includes a storage module, circulation loop, process module, and spiking module to maintain the concentration of substances in the cleaning mixture by continuously detecting the concentration of chemicals and adding a supply solution as needed, ensuring the mixture is dispensed on the substrate with the correct concentration, thereby mitigating chemical decay and metal impurity effects.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of substance
If the cleaning mixture is reused for multiple substrates, then manufacturing cost is reduced, but chemical concentration degrades and metal impurities accumulate
Solution Approach 1:
The system continuously monitors the concentration of substances in the cleaning mixture using sensors, and automatically adjusts the mixture composition by adding fresh chemicals or removing contaminated portions based on real-time feedback, thereby maintaining effective concentration levels throughout extended reuse periods
Solution Approach 2:
The system dynamically changes the chemical composition parameters of the cleaning mixture by selectively adding fresh chemicals or removing portions of the mixture based on monitored concentration levels and metal impurity accumulation, allowing the mixture to be refreshed without complete replacement
2Manufacturing precision
If fresh cleaning mixture is used for each substrate, then processing performance is maintained, but manufacturing cost increases
Solution Approach 1:
Instead of discarding the entire cleaning mixture after a single use, the system recovers valuable chemicals by removing only the portions contaminated with metal impurities or depleted in concentration, and replenishes only the necessary amounts to restore effectiveness
Solution Approach 2:
Real-time monitoring of chemical concentration and metal impurity levels provides feedback that enables precise determination of when and how much fresh chemical needs to be added, avoiding both over-consumption and under-maintenance of the cleaning mixture
3Object-generated harmful factors
If the cleaning mixture is circulated continuously, then metal impurity accumulation is reduced, but system complexity increases
Solution Approach 1:
The system extracts and removes metal impurities from the circulating cleaning mixture through filtration or separation mechanisms, allowing the bulk of the mixture to be retained and reused while periodically removing accumulated contaminants
Solution Approach 2:
The cleaning mixture is circulated continuously through the processing system, maintaining constant motion that prevents stagnation and reduces metal impurity accumulation, with periodic intervention to remove accumulated contaminants
Data Source
AI summary
A method of processing a substrate in semiconductor fabrication is provided. The method includes supplying a mixture from a storage module to a chamber via an inlet conduit. The method further includes detecting the concentration of a substance in the mixture. The method also includes dispensing the mixture over a substrate disposed in the chamber. In addition, the method includes supplying a supply solution including the substance to the chamber via the inlet conduit and dispensing the supply solution over the substrate when the concentration of the substance in the mixture is less than a desired value. The supply solution is supplied to the inlet conduit at a first position that is at a portion of the inlet conduit extending in the chamber.