Substrate Cleaning via Dissolving Solution and Polymer Film Peeling
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Solution Overview
Problem
The existing substrate cleaning processes face inefficiencies in removing particles from fine patterns due to insufficient penetration of treating liquids, leading to waste and ineffective particle removal, especially when using liquids with volatile solvents.
Innovation Solution
A substrate treating method involving a dissolving solution and a treating liquid with a polymer, where the dissolving solution is supplied at a controlled temperature and rotation speed to form a liquid film, allowing the treating liquid to effectively reach and solidify on the substrate, followed by peeling and rinsing to remove particles and residues.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the amount of treating liquid supplied is increased to improve particle removal, then particle removal effectiveness is improved, but treating liquid waste increases and cleaning efficiency does not significantly improve
Solution Approach 1:
A dissolving solution is supplied onto the substrate before the treating liquid to pre-wet the substrate surface and penetrate fine patterns. This preliminary action prepares the substrate to receive the treating liquid more effectively, allowing the treating liquid to reach particle locations with less total liquid volume, thereby reducing waste while maintaining particle removal effectiveness
Solution Approach 2:
The dissolving solution acts as an intermediary substance between the treating liquid and the substrate. It first contacts the substrate, dissolves organic substances, and creates a prepared surface that enables subsequent treating liquid to penetrate fine patterns and reach particles more effectively, reducing the overall amount of treating liquid needed
2Reliability
If the treating liquid is supplied onto the substrate to remove particles, then particle removal is achieved, but the treating liquid does not sufficiently reach between fine patterns
Solution Approach 1:
The dissolving solution is supplied first to pre-wet the substrate surface and penetrate into fine patterns before the treating liquid is applied. This preliminary penetration creates channels and reduces surface tension barriers, enabling the subsequent treating liquid to reach between fine patterns and access particles that would otherwise be inaccessible
Solution Approach 2:
The dissolving solution serves as an intermediary that first contacts and wets the substrate surface, including areas between fine patterns. This intermediary action reduces surface tension and creates a prepared pathway that allows the treating liquid to penetrate deeper into fine patterns and reach particles in previously inaccessible areas
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method enhances cleaning efficiency, reduces the amount of treating liquid used, and ensures effective particle removal from intricate substrate patterns, improving the overall cleaning process.
Implementation Method 1
supplying a dissolving solution onto a rotating substrate
Implementation Method 2
the polymer is solidified due to a change in volume of the treating liquid and adsorbs particles
Implementation Method 3
Once the solvent containing a volatile component is volatilized, the polymer is solidified due to a change in volume of the treating liquid
Data Source
AI summary
The inventive concept provides a substrate treating method. The substrate treating method includes supplying a dissolving solution onto a rotating substrate; and supplying, after the supplying a dissolution solution, a treating liquid including a polymer onto the rotating substrate to form a liquid film.