Substrate Cleaning and Drying for Liquid Immersion Exposure

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Solution Overview

Problem

Conventional substrate processing apparatuses face operational troubles and processing defects due to liquid adherence during liquid immersion exposure methods, leading to contamination and defects in substrates.

Innovation Solution

A substrate processing apparatus with integrated cleaning and drying processing units is introduced, which cleans and dries the substrate before and after exposure processing, preventing liquid adherence and subsequent contamination, and includes a platform for temperature control to optimize substrate handling and reduce transportation steps.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Manufacturing precision

If liquid immersion exposure method is used to achieve finer exposure patterns, then manufacturing precision is improved, but operational troubles and processing defects occur due to liquid adherence to substrate

Engineering Contradiction:
Improveexposure pattern finenessVSAvoidoperational reliability
Core Design Contradiction:
Manufacturing precisionVSReliability

Solution Approach 1:

The patent applies preliminary action by introducing a drying processing unit that performs drying treatment on the substrate immediately after liquid immersion exposure. This preliminary drying prevents liquid adherence before the substrate is transported out of the exposure device, thereby eliminating operational troubles while maintaining the benefits of liquid immersion exposure for fine pattern formation

Inventive Principle:
Principle #10Preliminary action

2Manufacturing precision

If liquid immersion exposure method is used to achieve finer exposure patterns, then manufacturing precision is improved, but processing defects occur due to particle adherence to liquid-coated substrate

Engineering Contradiction:
Improveexposure pattern finenessVSAvoidparticle contamination
Core Design Contradiction:
Manufacturing precisionVSObject-affected harmful factors

Solution Approach 1:

The patent applies preliminary action by performing drying processing immediately after liquid immersion exposure to remove liquid from the substrate surface. This preliminary removal of liquid prevents particles in the surrounding environment from adhering to the liquid-coated substrate, thereby eliminating processing defects while maintaining the fine pattern formation capability of liquid immersion exposure

Inventive Principle:
Principle #10Preliminary action

3Productivity

If substrate is transported directly after liquid immersion exposure, then productivity is maintained, but operational troubles occur due to liquid dropping in processing apparatus

Engineering Contradiction:
Improveprocessing throughputVSAvoidapparatus operational reliability
Core Design Contradiction:
ProductivityVSReliability

Solution Approach 1:

The patent applies merging by integrating the drying processing unit within the exposure device itself, combining the exposure and drying functions in one location. This allows the substrate to be dried in-place immediately after exposure without requiring separate transport steps, thereby maintaining high productivity while preventing liquid adherence and subsequent operational troubles

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The patent applies preliminary action by performing drying processing immediately after liquid immersion exposure, before the substrate leaves the exposure device. This preliminary drying ensures that no liquid remains on the substrate during transport, preventing liquid dropping and operational troubles while maintaining efficient processing throughput

Inventive Principle:
Principle #10Preliminary action

Data Source

PatentUS7722267B2Substrate processing apparatus
Publication Date: 2010.05.25 SCREEN SEMICON SOLUTIONS CO LTD
  • US7722267B2 patent drawing
  • US7722267B2 patent drawing
  • US7722267B2 patent drawing

AI summary

A substrate processing apparatus comprises an interface block. An exposure device is arranged adjacent to the interface block. The interface block comprises first and second cleaning/drying processing units. A substrate W is subjected to cleaning and drying processing before exposure processing in the first cleaning/drying processing unit, while being subjected to cleaning and drying processing after the exposure processing in the second cleaning/drying processing unit.