Substrate Cleaning Chamber for Dual-Side Contamination Removal
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Solution Overview
Problem
Current substrate cleaning technologies face challenges in effectively removing foreign materials, particularly metals, from substrates coated with photoresist materials during semiconductor manufacturing processes, and in preventing contamination during substrate processing.
Innovation Solution
A substrate cleaning system comprising a wet chamber for applying developing and wetting solutions, a drying chamber using supercritical fluids to dry the substrate, and a cleaning chamber with upper and lower nozzles to supply cleaning solutions to both surfaces of the substrate, ensuring thorough removal of foreign materials and preventing contamination.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If conventional cleaning methods are used, then the cleaning process is simple, but foreign materials on the substrate cannot be effectively removed
Solution Approach 1:
The cleaning system is divided into multiple independent nozzle units (upper cleaning nozzle, lower cleaning nozzle, edge cleaning nozzle) that can be positioned at different locations to clean different areas of the substrate. Each nozzle can be independently controlled to deliver cleaning solution to specific regions, enabling comprehensive coverage while maintaining modular simplicity
Solution Approach 2:
The cleaning system transitions from conventional single-sided or top-down cleaning to three-dimensional multi-directional cleaning by adding nozzles positioned above, below, and at the edges of the substrate. This spatial arrangement enables foreign materials on all surfaces including the bottom and edges to be removed effectively
2Manufacturing precision
If thorough cleaning of all substrate surfaces is performed, then foreign material removal is improved, but contamination risk increases
Solution Approach 1:
The substrate is lifted off the processing table using support pins, elevating it to a suspended position where cleaning nozzles can access all surfaces including the bottom. This extraction from the table surface prevents contact contamination while enabling comprehensive cleaning of previously inaccessible areas
Solution Approach 2:
The cleaning chamber maintains a controlled environment where cleaning operations are performed. The substrate is cleaned in an enclosed space with controlled atmosphere, reducing the risk of external contamination while thorough cleaning removes foreign materials from all surfaces
3Manufacturing precision
If the substrate is cleaned while supported on the processing table, then the process is simple, but the bottom surface and edges cannot be cleaned
Solution Approach 1:
The support pins automatically lift the substrate when cleaning nozzles approach, and the substrate returns to the table when cleaning is complete. This self-activating mechanism eliminates the need for complex external actuation systems while enabling bottom surface access
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The system efficiently cleans substrates by removing foreign materials from all surfaces, including edges and bottoms, while preventing contamination, ensuring a clean and contamination-free processing environment for semiconductor manufacturing.
Implementation Method 1
supplying a supercritical fluid onto the wetted substrate to dry the substrate
Data Source
AI summary
A method of processing a substrate includes wetting a substrate, supplying a supercritical fluid onto the wetted substrate to dry the substrate, and cleaning the dried substrate. The cleaning of the substrate includes supplying a cleaning solution onto a top surface of the substrate, and supplying a cleaning solution onto a bottom surface of the substrate.