Substrate Cleaning Apparatus with Edge-Clamp and Local Liquid Delivery
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Solution Overview
Problem
Conventional cleaning methods for lithography substrates are inefficient, causing discomfort due to excessive cleaning liquid and often result in water marks, compromising the cleanliness and effectiveness of the substrate.
Innovation Solution
A substrate-cleaning apparatus comprising a transmission unit, wet cleaning unit with a nanobubble-producing wiper, and a dry cleaning unit using a cleaning cloth to minimize liquid usage and prevent water marks, featuring a clamp to handle the substrate without covering it, ensuring thorough cleaning and drying without interference.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If a large amount of cleaning liquid is used to wash the substrate, then the cleaning effectiveness is improved, but water marks are left on the substrate and worker comfort deteriorates
Solution Approach 1:
The patent extracts only the necessary amount of cleaning liquid needed for effective cleaning, eliminating the excessive liquid that causes water marks. The wiper applies cleaning liquid locally and precisely to the substrate surface, taking out only the required portion rather than using a large amount of liquid.
Solution Approach 2:
The cleaning liquid is applied locally to specific areas of the substrate that require cleaning, rather than uniformly across the entire substrate. The wiper delivers cleaning liquid precisely where needed, creating local quality in terms of liquid distribution that improves cleaning effectiveness while minimizing water mark formation.
2Manufacturing precision
If a large amount of cleaning liquid is used to wash the substrate, then the cleaning effectiveness is improved, but worker comfort deteriorates due to exposure to cleaning liquid
Solution Approach 1:
The system extracts and delivers cleaning liquid in controlled, minimal amounts directly to the substrate through the wiper, eliminating the need for workers to handle or be exposed to large quantities of cleaning liquid. The liquid is taken out from the reservoir and applied precisely where needed.
Solution Approach 2:
The apparatus performs the cleaning function automatically through the wiper mechanism, reducing the need for direct worker involvement with cleaning liquid. The system serves itself by automatically delivering and applying the cleaning liquid, minimizing worker exposure.
3Strength
If the clamp covers the substrate face, then the substrate is securely held, but the cleaning area is reduced
Solution Approach 1:
The clamp is segmented into multiple fingers or jaws that can grip the substrate edges without forming a single large covering structure. This segmentation allows the clamp to hold the substrate securely while leaving the substrate face exposed and accessible for cleaning operations.
Solution Approach 2:
Instead of the clamp covering the substrate face to hold it, the clamp is designed to hold the substrate from the edges or periphery, inverting the conventional approach. This allows the face to remain uncovered and fully accessible for cleaning while still providing secure holding.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The apparatus effectively cleans lithography substrates using minimal cleaning liquid and prevents water marks, enhancing the cleanliness and reducing operational discomfort while maintaining the substrate's integrity.
Implementation Method 1
an abutting element for pressing the cleaning cloth against the face of the substrate
Implementation Method 2
The liquid pump sends cleaning liquid to the abutting element
Implementation Method 3
a strip of cleaning cloth for wiping dry the face of the substrate
Data Source
AI summary
A substrate-cleaning apparatus includes a transmission unit, a wet cleaning unit and a dry cleaning unit. The transmission unit includes a movable clamp for clamping a substrate that includes a face without covering the face of the substrate. The wet cleaning unit includes a wiper and a liquid pump. The wiper includes a strip of cleaning cloth and an abutting element for pressing the cleaning cloth against the face of the substrate. The liquid pump sends cleaning liquid to the abutting element that in turn sends the cleaning liquid to the cleaning cloth when the abutting element presses the cleaning cloth against the face of the substrate. The dry cleaning unit includes a wiper comprising a strip of cleaning cloth for wiping dry the face of the substrate without leaving any water mark on the face.