Substrate Cleaning Exhaust Control for Multi-Tool Cleanliness
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Solution Overview
Problem
Existing substrate cleaning devices face limitations in maintaining high cleanliness due to insufficient exhaust capacity when multiple devices are installed, leading to a bottleneck in the number of devices that can be used in a factory setting.
Innovation Solution
A substrate cleaning device with a dual substrate holder system, where one holder maintains a horizontal posture without rotation and the other rotates, combined with an exhaust system that regulates gas flow rates to manage cleanliness and reduce exhaust capacity requirements.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If multiple substrate cleaning devices are installed to increase productivity, then the number of substrates cleaned per unit time increases, but the exhaust capacity required increases proportionally, limiting the number of devices that can be installed with existing exhaust equipment
Solution Approach 1:
The exhaust flow rate is made dynamic by switching between a first flow rate during non-rotation periods and a second flow rate during rotation periods. This dynamic adjustment allows the system to maintain high cleanliness only when necessary (during rotation when splashing occurs) while reducing exhaust capacity requirements during non-rotation periods, enabling more devices to be installed with the same exhaust equipment.
Solution Approach 2:
The exhaust flow rate parameter is changed based on the operational state of the substrate holder. When the substrate holder rotates, the exhaust flow rate is increased to the second flow rate to handle splashed cleaning liquid. When rotation stops, the exhaust flow rate is reduced to the first flow rate. This parameter change optimizes the balance between cleanliness maintenance and exhaust capacity requirements.
2Object-affected harmful factors
If the exhaust flow rate is continuously maintained at a high level to ensure high cleanliness, then cleanliness is maintained, but the exhaust capacity required increases, limiting the number of devices that can be installed
Solution Approach 1:
The exhaust system operates periodically by switching between high flow rate (second flow rate) during rotation periods when splashing occurs and low flow rate (first flow rate) during non-rotation periods. This periodic action maintains high cleanliness during critical periods while significantly reducing the average exhaust capacity required, allowing more devices to be installed with existing exhaust equipment.
Solution Approach 2:
The exhaust flow rate is dynamically adjusted based on the rotation state of the substrate holder. The system transitions between two discrete flow rate states (first and second flow rates) corresponding to non-rotation and rotation operations. This dynamic control ensures high cleanliness during rotation while minimizing exhaust capacity requirements during non-rotation periods.
3Quantity of substance
If the substrate is held without rotation to reduce exhaust requirements, then exhaust capacity is reduced, but the cleaning effectiveness may be compromised
Solution Approach 1:
The substrate holder dynamically switches between rotation and non-rotation states based on cleaning requirements. During rotation, the second flow rate maintains high cleanliness to handle splashed cleaning liquid. During non-rotation, the first flow rate reduces exhaust capacity requirements. This dynamic operation allows the system to achieve effective cleaning while optimizing exhaust capacity usage.
Solution Approach 2:
The cleaning process utilizes periodic rotation of the substrate holder to achieve effective cleaning through centrifugal force and liquid distribution, followed by non-rotation periods where exhaust capacity requirements are reduced. This periodic action between rotation and non-rotation states allows the system to maintain cleaning effectiveness while minimizing average exhaust capacity requirements.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The system effectively maintains high cleanliness in multiple devices by optimizing gas flow rates and substrate handling, reducing the overall exhaust capacity needed, allowing more devices to be used with existing equipment.
Implementation Method 1
a second substrate holder that rotates a substrate about an axis extending in an up-and-down direction while holding the substrate in a horizontal attitude by sucking the substrate
Implementation Method 2
an exhaust system that connects the processing space and exhaust equipment provided outside of the processing chamber to each other, and exhausts gas in the processing space using the exhaust equipment
Data Source
AI summary
An upper holding device holds a substrate in a horizontal attitude without rotating the substrate. A lower holding device rotates a substrate while holding the substrate by suction. A substrate held by the upper holding device is cleaned with use of a cleaning liquid, and a substrate held by the lower holding device is cleaned with use of a cleaning liquid. Gas in a processing space is exhausted by exhaust equipment of a factory through an exhaust system. When a substrate is held by the upper holding device, gas in the processing space is not exhausted or gas in the processing space is exhausted at a first flow rate. Gas in the processing space is exhausted at a second or third flow rate that is higher than the first flow rate when the substrate is held by the lower holding device.