Substrate Cleaning Head Pressure Control for Warpage
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Solution Overview
Problem
Conventional substrate cleaning apparatuses face challenges in maintaining consistent contact pressure and cleaning performance due to substrate warpage and varying surface heights, leading to deformation and detachment of cleaning heads during radial movement.
Innovation Solution
A substrate cleaning apparatus with a controller that adjusts contact pressure and movement speed of the cleaning head, reducing stress and improving cleaning performance by maintaining appropriate contact pressure near the edge and center of the substrate, and optimizing the movement locus to prevent high contact pressure and deformation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If the substrate is supported at the edge and the cleaning head moves in radial direction, then the cleaning process can be simplified, but the contact pressure becomes uneven due to substrate warpage
Solution Approach 1:
The cleaning head height is dynamically adjusted based on the radial position during cleaning. The control unit varies the height of the cleaning head according to the radial position, which compensates for substrate warpage and maintains uniform contact pressure across the substrate surface.
Solution Approach 2:
The system changes the height parameter of the cleaning head based on radial position. By adjusting the cleaning head height according to the radial position, the system compensates for the substrate's curved shape and ensures consistent contact pressure from center to edge.
2Device complexity
If the cleaning head moves at constant speed in radial direction, then the movement control is simplified, but the cleaning performance becomes uneven due to varying surface speed
Solution Approach 1:
The moving speed parameter of the cleaning head is varied according to radial position. The control unit adjusts the moving speed based on the radial position, compensating for the varying surface speed caused by substrate rotation and ensuring uniform cleaning performance across different regions.
3Manufacturing precision
If the contact pressure is increased to improve cleaning performance, then cleaning effectiveness improves, but the cleaning head deformation and detachment risk increases
Solution Approach 1:
The contact pressure is optimized for each radial position rather than applying uniform high pressure. By adjusting the cleaning head height according to radial position, the system achieves appropriate contact pressure locally at each position, improving cleaning performance while preventing excessive stress that could cause deformation or detachment.
4Manufacturing precision
If the cleaning head is positioned to maintain consistent contact pressure, then cleaning uniformity improves, but the movement mechanism complexity increases
Solution Approach 1:
The system uses a control unit that receives radial position information and automatically adjusts the cleaning head height accordingly. This feedback mechanism simplifies the movement mechanism by using automated control rather than complex mechanical adjustments, while maintaining consistent contact pressure for uniform cleaning.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively reduces the risk of deformation and detachment of the cleaning head, enhances cleaning performance, and maintains productivity by adjusting contact pressure and movement speed according to the substrate's radial position, thereby ensuring thorough cleaning and reducing substrate warpage-related issues.
Implementation Method 1
the sponge of the cleaning head is dragged by the substrate because of the frictional force between the substrate and the sponge
Data Source
AI summary
A substrate cleaning apparatus (50) that cleans a substrate (S) includes: circumference supporting members (51) that support and rotate the substrate (S); a sponge (541) having a cleaning surface that is brought into contact with the surface to be cleaned of the substrate (S) being rotated by the circumference supporting members (51), and cleans the surface to be cleaned; an arm (53) that moves the sponge (541) in a radial direction of the substrate (S) while maintaining the cleaning surface in contact with the surface to be cleaned; and a controller (60) that controls the contact pressure of the cleaning surface on the surface to be cleaned. When the sponge (541) is located near the edge of the substrate (S), the controller (60) adjusts the contact pressure to a smaller value than that of when the sponge (541) is located near the center of the substrate (S).