Substrate Cleaning Chamber Humidity Control to Suppress Mist
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Solution Overview
Problem
The generation of mist during substrate cleaning processes in semiconductor manufacturing leads to contamination, as the increased pressure from cleaning liquids on rotating substrates causes mist to adhere to the treating container walls, which can contaminate subsequent substrates.
Innovation Solution
A substrate treating apparatus with a heating unit to adjust the relative humidity of the treating space, combined with a cleaning unit that supplies liquids to both the center and edge regions of the substrate, and a support system that rotates and moves the substrate to ensure thorough cleaning and minimize mist generation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If cleaning liquid is supplied to the bottom surface of a rotating substrate, then cleaning efficiency is improved, but pressure increases rapidly causing mist generation and contamination
Solution Approach 1:
The heating unit pre-heats the cleaning liquid before it contacts the substrate. This preliminary heating reduces the temperature differential between the liquid and substrate, preventing rapid vaporization and mist generation while maintaining effective cleaning capability
Solution Approach 2:
The temperature of the cleaning liquid is changed from ambient to elevated (heated) state. This parameter change modifies the liquid's vapor pressure and evaporation rate, reducing mist formation during the cleaning process while preserving cleaning effectiveness
2Manufacturing precision
If cleaning liquid is supplied under pressure to clean the substrate, then cleaning effectiveness is improved, but mist is generated that adheres to container walls
Solution Approach 1:
The heating unit pre-heats the cleaning liquid before supply to the substrate. This preliminary heating reduces the liquid's tendency to vaporize under pressure, preventing mist generation that would otherwise adhere to and contaminate the treating container walls
Solution Approach 2:
The temperature parameter of the cleaning liquid is elevated through heating. This change reduces the vapor pressure and evaporation rate during pressurized cleaning, eliminating the source of contamination on container walls
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The apparatus efficiently cleans the substrate surfaces, reducing foreign substance generation and contamination by effectively managing pressure and humidity during the cleaning process.
Implementation Method 1
a heating unit configured to heat a fluid supplied to the treating space to adjust a relative humidity of the treating space
Data Source
AI summary
A substrate treating apparatus includes a housing having an inner space; a support positioned in the inner space and configured to support a substrate; a treating container having a treating space therein and surrounding the supported substrate. A cleaning unit may supply a liquid to the substrate supporting on the support and a heating unit may heat a fluid that is supplied to the treating space to decrease a relative humidity of the treating space.