Substrate Cleaning Nozzle Angles for Uniform Detergency
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Solution Overview
Problem
Existing substrate cleaning apparatuses may not achieve sufficient detergency, especially with the increasing cleanliness requirements in semiconductor wafer processing.
Innovation Solution
A substrate cleaning apparatus that includes a first cleaning liquid supplier spraying at a first angle towards the substrate's center and a second supplier spraying at a greater angle towards the substrate's edge, utilizing centrifugal force to efficiently clean and prevent liquid residue, with optional nozzles for pure water and chemical liquid distribution.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If a single cleaning liquid supplier sprays toward the substrate center, then the center area can be cleaned, but the edge area cleaning effectiveness is insufficient
Solution Approach 1:
The cleaning liquid supplier is divided into multiple nozzles (first nozzles and second nozzles) that spray cleaning liquid at different angles. The first nozzles spray at a first angle toward the substrate center, while the second nozzles spray at a second angle (greater than the first angle) toward the area between the substrate center and edge, achieving segmented cleaning coverage.
Solution Approach 2:
Different regions of the substrate receive cleaning liquid with different spray angles tailored to their specific cleaning needs. The center area receives spray at a first angle optimized for center cleaning, while the intermediate area receives spray at a second angle optimized for edge-proximity cleaning, creating local quality optimization.
2Reliability
If cleaning liquid is sprayed at a shallow angle toward the substrate center, then liquid residue is reduced, but cleaning coverage of the edge area is insufficient
Solution Approach 1:
The nozzle system is segmented into first nozzles and second nozzles with different spray angles. The first nozzles use a shallower first angle to control liquid residue on the substrate center, while the second nozzles use a steeper second angle to extend cleaning coverage toward the substrate edge, resolving the trade-off between residue control and coverage.
3Reliability
If multiple cleaning liquid suppliers with different spray angles are used, then cleaning effectiveness is improved, but device complexity increases
Solution Approach 1:
Multiple cleaning liquid suppliers (first and second nozzles with different spray angles) are merged into a single integrated cleaning liquid supplier assembly. This combining approach maintains the detergency benefits of multi-angle spraying while reducing device complexity by consolidating the nozzle system into one unified structure.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Improves detergency by efficiently cleaning the substrate's center and edge areas, reducing liquid residue, and allowing for uniform pH distribution, while optimizing the cleaning process with adjustable nozzle configurations.
Implementation Method 1
utilizing centrifugal force to efficiently clean and prevent liquid residue
Data Source
AI summary
According to one embodiment, a substrate cleaning apparatus that cleans a substrate while rotating the substrate, the substrate cleaning apparatus includes: a first cleaning liquid supplier that sprays cleaning liquid in a spray shape at a first spraying angle toward a center of the substrate; and a second cleaning liquid supplier that sprays cleaning liquid in a spray shape at a second spraying angle greater than the first spraying angle toward an area between the center of the substrate and an edge of the substrate.