Substrate Cleaning Nozzle Cover for Secondary Contamination Control
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Solution Overview
Problem
Existing substrate cleaning apparatuses face challenges in preventing secondary contamination and improving drying yield due to particles and foreign materials scattered by dual fluid sprays during the cleaning process.
Innovation Solution
A substrate cleaning apparatus with a modified nozzle design featuring a cover with an inlet surrounding the spray hole, creating an air flow passage to suck and discharge air, which prevents DIW and foreign materials from being re-adsorbed onto the substrate, enhancing cleaning efficiency and drying yield.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If a dual fluid spray is used to clean the substrate, then foreign materials are removed effectively, but scattered DIW particles and foreign materials are re-adsorbed onto the substrate surface causing secondary contamination
Solution Approach 1:
The patent extracts and removes scattered DIW particles and foreign materials from the substrate surface by introducing a suction unit that actively sucks away these particles through a suction hole, preventing their re-adsorption and eliminating secondary contamination while maintaining effective cleaning
Solution Approach 2:
The patent introduces air as an intermediary substance that flows through the air flow passage to carry scattered DIW particles and foreign materials away from the substrate surface, using the air stream as a mediator to transport contaminants without direct contact with the substrate
2Device complexity
If the nozzle structure is simplified, then device complexity is reduced, but cleaning capability and drying yield are insufficient
Solution Approach 1:
The patent merges multiple functions into a single integrated nozzle structure that combines spray holes for dual fluid delivery, air flow passages for particle removal, and suction holes for contaminant extraction, achieving both effective cleaning and high drying yield without requiring multiple separate components
Solution Approach 2:
The nozzle is designed with multi-functionality, serving as both a spray device for cleaning and a suction device for particle removal, while also providing air flow for drying, thereby increasing drying yield and cleaning effectiveness without proportionally increasing device complexity
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The apparatus effectively prevents secondary contamination and improves substrate cleaning capability and drying yield by efficiently removing scattered particles and liquids, maintaining a clean and dry environment.
Implementation Method 1
an air flow passage formed in a space between the cover and the spray nozzle and through which air sucked from the inlet flows
Implementation Method 2
a dual fluid spray is a method of simultaneously spraying high-pressure gas and a liquid such as de-ionized water (DIW). The dual fluid spray may pulverize DIW in a liquid state into micro-particles and make DIW collide with the substrate
Data Source
AI summary
A substrate cleaning apparatus includes a stage on which a substrate is placed, a support unit configured to support the substrate and to rotate the substrate, and a cleaning unit configured to spray a dual fluid to clean the substrate, wherein the cleaning unit may include a spray nozzle including a spray hole opened toward the stage and configured to spray a dual fluid through the spray hole, a cover that may include an inlet surrounding at least a partial area of an outer circumferential surface of the spray hole, that may surround at least a partial area of an outer circumferential surface of the spray nozzle, and that may be spaced apart from the spray nozzle by a predetermined distance, and an air flow passage formed in a space between the cover and the spray nozzle and through which air sucked from the inlet flows.


