Substrate Cleaning Nozzle Flow to Prevent Gas Liquefaction Defects
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Solution Overview
Problem
Existing substrate cleaning methods often result in defects such as stain-like defects and pattern collapse due to improper handling of gas mixtures during the cleaning process, particularly when the carrier gas escapes before the cluster forming gas, leading to liquefaction and adhesion of impurities on the substrate surface.
Innovation Solution
A substrate cleaning method involving the continuous supply of a carrier gas for a set time period after the cluster forming gas is stopped, ensuring the cluster forming gas is replaced and preventing liquefaction, along with controlled gas pressure and flow rates to manage cluster size and adiabatic expansion for effective particle removal.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If the carrier gas is stopped immediately when the cluster forming gas is stopped, then the gas supply process is simple and short, but the cluster forming gas remains in the nozzle and liquefies, causing defects on the substrate
Solution Approach 1:
The patent applies preliminary action by continuing to supply the carrier gas for a predetermined time period after stopping the cluster forming gas. This preliminary continuation of carrier gas supply ensures that the nozzle is completely cleared of cluster forming gas before the carrier gas supply is also stopped, preventing liquefaction and substrate defects.
2Loss of substance
If the carrier gas flow rate is reduced too much, then the gas consumption is reduced and the process is more economical, but the cluster forming gas cannot be effectively replaced, leading to liquefaction
Solution Approach 1:
The patent applies parameter changes by optimizing the carrier gas flow rate to maintain it at a level that ensures complete replacement of cluster forming gas from the nozzle. The flow rate is controlled to be sufficient for effective gas replacement while being economical, balancing gas consumption with substrate quality.
3Manufacturing precision
If the cluster forming gas is supplied for a longer time to ensure complete particle removal, then the cleaning effectiveness is improved, but the process time increases and more gas is consumed
Solution Approach 1:
The patent applies continuity of useful action by maintaining the carrier gas supply continuously for a predetermined time period after the cluster forming gas is stopped. This continuous carrier gas flow ensures that the nozzle is completely cleared of cluster forming gas, preventing liquefaction and defects, while optimizing the overall process time and gas consumption.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach effectively suppresses the occurrence of defects like stain-like marks and pattern collapse, ensuring a clean substrate surface by maintaining the carrier gas flow to prevent cluster forming gas liquefaction and optimizing cluster size for efficient particle removal.
Implementation Method 1
continuously supplying the carrier gas to the nozzle for a set time period from an end time of the supply of the cluster forming gas to the nozzle
Implementation Method 2
supplying a gas mixture of a cluster forming gas for forming a cluster by adiabatic expansion
Data Source
AI summary
A substrate cleaning method includes: supplying a gas mixture of a cluster forming gas for forming a cluster by adiabatic expansion and a carrier gas having a smaller molecular weight or atomic weight than the cluster forming gas to a nozzle; forming the cluster by injecting the gas mixture from the nozzle; removing particles adhering to the substrate by the cluster; and continuously supplying the carrier gas to the nozzle for a set time period from an end time of the supply of the cluster forming gas to the nozzle.