Semiconductor Substrate Cleaning via Particle Size Modification
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Current cleaning methods for semiconductor devices and flat panel displays struggle to effectively remove nano-meter order particles due to the low hydrodynamic drag force on small particles, which can cause damage to delicate patterns when increasing fluid velocity for removal.
Innovation Solution
The method involves increasing the size of particles on the substrate through chemical modifications using surface modifiers or polymers, allowing for improved hydrodynamic drag force and efficient removal without damaging the patterns.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If fluid velocity is increased to remove particles, then particle removal efficiency is improved, but damage to delicate patterns occurs
Solution Approach 1:
The patent changes the physical-chemical parameters of particles by coating them with polymers or surfactants, transforming nano-meter order particles into larger aggregates. This parameter change allows effective removal at lower fluid velocities, resolving the contradiction between removal efficiency and pattern damage.
Solution Approach 2:
The patent introduces polymers and surfactants as intermediary substances that bind to particles and facilitate their removal. These intermediaries enable particle removal through chemical and physical mechanisms rather than relying solely on high-velocity fluid dynamics, thus protecting delicate patterns.
2Productivity
If conventional cleaning operations are performed, then general particle removal is achieved, but nano-meter order particles remain
Solution Approach 1:
The patent applies parameter changes by modifying particle size through polymer coating and surfactant treatment. This transforms undetectable nano-meter particles into larger aggregates that can be effectively removed by conventional cleaning operations, achieving the desired manufacturing precision.
Solution Approach 2:
The patent performs preliminary action by coating particles with polymers and surfactants before the actual cleaning process. This pre-treatment makes particles removable through subsequent conventional cleaning operations, enabling effective removal of nano-size particles that would otherwise remain.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enhances particle removal efficiency by increasing particle size, enabling effective cleaning of nano-size particles without damaging the substrate's patterns, even at lower fluid velocities.
Implementation Method 1
a polymer or a surfactant is used as the size-modification material... Size-modified particles having a larger size than the particles caused by the plasma processing are generated
Implementation Method 2
it is generally difficult to remove nano-meter order particles... enhancing particle removal efficiency by increasing particle size, enabling effective cleaning of nano-size particles... improved hydrodynamic drag force
Data Source
AI summary
In a method of cleaning a substrate, a solution including a size-modification material is applied on a substrate, on which particles to be removed are disposed. Size-modified particles having larger size than the particles are generated, from the particles and the size-modification material. The size-modified particles are removed from the substrate.