Substrate Cleaning via Peeling Particle Holding Layer
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Solution Overview
Problem
Existing substrate cleaning methods face challenges in efficiently removing particles and preventing residues of the particle holding layer from re-attaching to the substrate, as the particle holding layer is often dissolved during removal, leading to reduced efficiency and residual contamination.
Innovation Solution
A method involving a processing liquid with a solute and solvent that forms a particle holding layer on the substrate, which is then peeled using a peeling liquid, followed by a residue removal step with a solvent-compatible liquid to dissolve and remove any remaining residues, ensuring high removal efficiency and preventing re-attachment.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If the particle holding layer is dissolved on the substrate, then particles are removed from the substrate, but the layer may be re-attached to the substrate reducing removal efficiency
Solution Approach 1:
The invention divides the cleaning process into two distinct segments: (1) peeling the particle holding layer from the substrate, and (2) removing the peeled layer and particles together. This segmentation prevents the layer from dissolving on the substrate, thereby eliminating the re-attachment problem while maintaining high particle removal efficiency.
Solution Approach 2:
Instead of dissolving the particle holding layer on the substrate (conventional method), the invention inverts the approach by peeling the layer off the substrate first, then removing it. This reversal of the removal mechanism prevents re-attachment and improves both particle removal efficiency and residue elimination.
2Productivity
If the particle holding layer is peeled and rinsed with liquid, then particles are removed, but fine residues may remain on the substrate
Solution Approach 1:
The invention ensures continuous removal action by peeling the particle holding layer and immediately removing it with the peeling liquid in a continuous process. This prevents fine residues from settling or re-attaching on the substrate, thereby maintaining both high particle removal efficiency and excellent surface cleanliness.
3Productivity
If conventional cleaning methods are used, then the process is simple, but particle removal efficiency is insufficient for fine patterns
Solution Approach 1:
The invention changes the physical-chemical parameters of the cleaning process by using a peeling liquid that specifically peels the particle holding layer without dissolving it. This parameter change enables effective particle removal from fine patterns while keeping the process relatively simple, avoiding the need for complex heating mechanisms.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach effectively removes particles with high efficiency while preventing residues of the particle holding layer from re-attaching to the substrate, enhancing cleaning efficacy and simplifying the process by eliminating the need for complex heating mechanisms.
Implementation Method 1
the solvent is at least partially volatilized from the processing liquid supplied to the upper surface of the substrate, by which the processing liquid is solidified or hardened to form a particle holding layer
Implementation Method 2
a solute composition which is the solute included in the particle holding layer has such properties that the solute composition is hardly soluble or insoluble in the peeling liquid before being heated at a temperature equal to or higher than a quality-changing temperature and the solute composition is also changed in quality by being heated at a temperature equal to or higher than the quality-changing temperature and becomes soluble in the peeling liquid
Data Source
AI summary
A substrate cleaning method includes a processing liquid supplying step which supplies a processing liquid that contains a solute and a volatile solvent to an upper surface of a substrate, a film forming step in which the solvent is at least partially volatilized from the processing liquid and solidified or hardened to form a particle holding layer on the upper surface of the substrate, and a removal step in which a peeling liquid is supplied to the upper surface of the substrate to peel and remove the particle holding layer. A solute composition in the solute is insoluble in the peeling liquid before being heated to a temperature equal/higher than a quality-changing temperature to become soluble in the peeling liquid. During film forming, the processing liquid is heated to a temperature below the quality-changing temperature, to form the particle holding layer, without changing the quality of the solute composition. A residue removal step that removes a residue removing liquid which dissolves before being heated to a temperature equal/higher than the quality-changing temperature is supplied to the upper surface of the substrate, to remove residues that remain.