Substrate Cleaning Composition for Peel-Off Particle Removal
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing substrate cleaning methods face challenges in effectively removing particles without causing physical or chemical damage, as films formed to hold particles often remain incompletely dissolved and can reattach particles.
Innovation Solution
A substrate cleaning solution comprising an insoluble or hardly soluble solute, a soluble solute, and a solvent, where the solvent is partially removed to form a film that holds particles, which is then peeled off using a remover, with the soluble solute acting as a trigger for film removal.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If a film is formed to hold particles and removed by a remover, then particles can be removed from the substrate, but the film cannot be fully dissolved and remains on the substrate
Solution Approach 1:
The film is segmented into two distinct types: a water-soluble film portion and an organic solvent-soluble film portion. This segmentation allows each portion to be removed by different mechanisms, ensuring complete film removal while maintaining effective particle holding capability. The water-soluble portion dissolves in aqueous removers, while the organic solvent-soluble portion dissolves in organic solvent-based removers, preventing any residual film from remaining on the substrate.
Solution Approach 2:
The film composition parameters are changed to include both water-soluble and organic solvent-soluble components. By adjusting the solubility parameters of the film materials, the invention enables the film to respond to different remover types, ensuring complete dissolution and removal. This parameter change transforms the film from a single-function structure to a multi-responsive structure that can be fully removed by appropriate removers.
2Manufacturing precision
If the formed film is all dissolved by the remover, then particles held in the film can be reattached, but if the film is not fully dissolved, particles remain held in the film
Solution Approach 1:
The film is divided into water-soluble and organic solvent-soluble portions, each designed to dissolve under specific conditions. This segmentation ensures that when the appropriate remover is applied, the film dissolves completely without leaving residues that could cause particle reattachment. The dual-solubility design prevents both incomplete dissolution (which would hold particles) and uncontrolled dissolution (which would release particles).
Solution Approach 2:
The film acts as an intermediary structure that temporarily holds particles during processing. By designing the film with controlled solubility characteristics, it serves as a reliable carrier that can be precisely removed when needed. The film's dual-solubility property allows it to function as a controllable intermediary that releases particles only when the appropriate remover triggers its dissolution, preventing premature particle reattachment.
3Manufacturing precision
If physical removal methods are used to remove particles, then particles can be removed without chemicals, but patterns become susceptible to physical or chemical damage
Solution Approach 1:
The invention replaces mechanical/physical particle removal methods with a chemical dissolution mechanism. Instead of using physical forces that could damage delicate patterns, the film holding particles is dissolved chemically by removers. This substitution eliminates the need for mechanical action on the substrate, thereby preventing physical damage to fine patterns while still achieving effective particle removal through film dissolution.
4Manufacturing precision
If chemicals are used to remove particles, then particles can be removed chemically, but patterns become susceptible to physical or chemical damage
Solution Approach 1:
The film serves as a protective intermediary between the particles and the substrate during chemical processing. By dissolving the film with appropriate removers, particles are released without requiring direct chemical action on the substrate or patterns. This intermediary approach allows chemical particle removal while protecting delicate patterns from harmful chemical exposure, as the chemicals act on the film rather than directly on the substrate.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables effective particle removal by forming a film that can be efficiently peeled off without detaching held particles, preventing film detachment and ensuring complete removal.
Implementation Method 1
the soluble solute (B) is soluble by the remover
Implementation Method 2
the substrate cleaning solution is dripped on a substrate and dried to remove at least a part of the solvent (C) to form a film
Data Source
AI summary
[Problem] To obtain a substrate cleaning solution capable of cleaning a substrate and removing particles. [Means for Solution] To provide a substrate cleaning solution comprising an insoluble or hardly soluble solute (A), a soluble solute (B), and a solvent (C), wherein the solvent (C) comprises water (C-1); and the content of the soluble solute (B) is 0.1 to 500 mass % based on water (C-1).